Kategoria BISAC: Technology & Engineering >> Electronics - Circuits - General

Photovoltaic technology has now developed to the extent that it is close to fulfilling the vision of a "solar-energy world," as devices based on this technology are becoming efficient, low-cost and durable. This book provides a comprehensive treatment of thin-film silicon, a prevalent PV material, in terms of its semiconductor nature, starting out with the physical properties, but concentrating on device applications. A special emphasis is given to amorphous silicon and microcrystalline silicon as photovoltaic materials, along with a model that allows these systems to be physically...

Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international...

Multicore Processors and Systems provides a comprehensive overview of emerging multicore processors and systems. It covers technology trends affecting multicores, multicore architecture innovations, multicore software innovations, and case studies of state-of-the-art commercial multicore systems. A cross-cutting theme of the book is the challenges associated with scaling up multicore systems to hundreds of cores.

The book provides an overview of significant developments in the architectures for multicore processors and systems. It includes chapters on fundamental...

The first book to harness the power of .NET for system design, System Level Design with .NET Technology constitutes a software-based approach to design modeling verification and simulation. World class developers, who have been at the forefront of system design for decades, explain how to tap into the power of this dynamic programming environment for more effective and efficient management of metadata and introspection and interoperability between tools.

Using readily available technology, the text details how to capture constraints and requirements at high...

A smart camera is an integrated machine vision system which, in addition to image capture circuitry, includes a processor, which can extract information from images without need for an external processing unit, and interface devices used to make results available to other devices. This book provides content on smart cameras for an interdisciplinary audience of professionals and students in embedded systems, image processing, and camera technology. It serves as a self-contained, single-source reference for material otherwise found only in sources such as conference proceedings, journal...

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

"Electrical Conductive Adhesives with Nanotechnologies" begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of...

This practical guide explains how to identify the origin of disturbances in electrical systems and analyze them for effective mitigation and control. Transients in Electrical Systems considers all transient frequencies, ranging from 0.1 Hz to 50 MHz, and discusses transmission line and cable modeling as well as frequency dependent behavior. Results of EMTP simulations, solved examples, and detailed equations are included in this comprehensive resource.

Transients in Electrical Systems covers:

• Transients...

"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC...

There is a growing need to understand and combat potential radiation damage problems in semiconductor devices and circuits. Assessing the billion-dollar market for detection equipment in the context of medical imaging using ionizing radiation, Electronics for Radiation Detection presents valuable information that will help integrated circuit (IC) designers and other electronics professionals take full advantage of the tremendous developments and opportunities associated with this burgeoning field.

Assembling contributions from industrial and academic experts, this...