Electrical Conductive Adhesives with Nanotechnologies

ISBN-13: 9780387887821 / Angielski / Twarda / 2009 / 452 str.

C. P. Wong; Yi Li; Daniel Lu

Opis

"Electrical Conductive Adhesives with Nanotechnologies" begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Recenzje

From the reviews:

"This book is a review of the most recent advances in various types of electrically conductive adhesives, with a focus on emerging nanotechnology, including materials development and characterizations ... . Our readers who are materials scientists and materials engineers who develop electrically conductive adhesives and conductive polymers for microelectronics applications would definitely find this book very interesting. It is an excellent resource of current ECA materials, processes, and technology ... . This is truly a worthwhile reference book to own for those develop ECAs." (Electrical Insulation Magazine, Vol. 27 (2), March/April, 2011)

Spis treści

Nanotechnology.- Characterizations of Electrically Conductive Adhesives.- Isotropically Conductive Adhesives (ICAs).- Anisotropically Conductive Adhesives/Films (ACA/ACF).- Non-Conductive Adhesives/Films (NCA/NCF).- Conductive Nano-Inks.- Intrinsically Conducting Polymers (ICPs).- Future Trend of Conductive Adhesive Technology.

Blurb

Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging, discussing the various electrical adhesive options currently available. The book focuses extensively on Electrically Conductive Adhesives (ECAs), as well as other adhesives such as lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors also present examples of how conductive adhesives can be applied to nano techniques, while making important mentions of recent research and development breakthroughs in the fields.

Drawing upon tireless research, years of theoretical development and practical experience, and utilizing numerous visual examples and illustrative applications, authors CP Wong, Yi Li and Daniel Lu cover electrically conductive adhesives in depth, while also describing:

• The electrical properties, thermal performance, bonding pressure, assembly and reliability of numerous types of electrically conductive adhesives
• The similarities and differences between lead-free soldering techniques and electrically conductive adhesives, while also discussing the advantages of ECAs.
• Insights into the future of nano ECAs, as well as projections of future industry trends.

Electrical Conductive Adhesives with Nanotechnologies is a must-read for both researchers and active engineers in the electronic packaging field.