Examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This book provides a framework for how to model the mechanism, test for defects, and avoid and manage damage.

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve...

This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program - but using a novelized form.