More-Than-Moore 2.5d and 3D Sip Integration

ISBN-13: 9783319849324 / Angielski / Miękka / 2018 / 182 str.

Riko Radojcic

Spis treści

Introduction.- More-than-Moore Technology Opportunities: 2.5D SiP.- More-than-Moore Technology Opportunities: 3D SiP.- More-than-Moore Design Eco-System.- More-than-Moore Adoption Landscape.

O autorze

Riko Radojcic is currently an independent consultant specialized in design and manufacturing with advanced semiconductor and packaging technologies, with a focus on 2.5D and 3D integration options and opportunities.

Most recently, he was a Senior Director of Technology at Qualcomm Technologies Inc. where he led the 2.5D and 3D Technology Integration team, addressing all aspects of advanced integration technology options, ranging from architecture down to manufacturability.  In the previous years with Qualcomm, Riko has led a number of Design-for-Technology initiatives; including Design-for-3D, Design-for-Thermal, Design-for-Stress, Design-for-Variability, Design-for-Manufacturability, etc.

Radojcic has more than thirty year’s experience in the semiconductor industry, and has specialized in integration of process technology and design considerations.  Before joining Qualcomm, he was an independent consultant to semiconductor and EDA companies providing engineering and business development services. Before that, he focused on design technology, process characterization and modeling integration, with PDF Solutions (director of marketing), Tality Corporation (Business Manager) and Cadence (architect).  Radojcic has held a series of managerial and engineering positions with Unisys and Burroughs, in device engineering, failure analyses and reliability engineering areas. He began his career as a process engineer with Ferranti Electronics, UK.

Radojcic received his BSc and PhD degrees from University of Salford (Manchester), UK.  

Blurb

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.