Guidebook for Managing Silicon Chip Reliability

ISBN-13: 9780849396243 / Angielski / Twarda / 1998 / 224 str.

Michael G. Pecht; Riko Radojcic;Pecht

Opis

Examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This book provides a framework for how to model the mechanism, test for defects, and avoid and manage damage.

Spis treści

Introduction How Devices Fail Intrinsic Mechanisms Extrinsic Mechanisms Intrinsic Device Sensitivities Device Transconductance Sensitivities Leakage Current Sensitivities Breakdown Issues Electromigration Description of the Mechanism Modeling of the Mechanism How to Detect/Test How to Manage Hot Carrier Aging Description of the Mechanism Modeling of the Mechanism Detection of Hot Carrier Aging Avoidance of Hot Carrier Aging Time Dependent Dielectric Breakdown Description of the Mechanism Modeling of the Mechanism How to Detect/Test How to Avoid and Manage Mechanical Stress Induced Migration Description of the Mechanism Modeling of the Mechanism How to Detect/Test How to Manage Alpha Particle Sensitivity Description of the Mechanism Modeling of the Mechanism Prevention of Alpha Particle Induced Damage Electrostatic Discharge and Electrical Overstress Description of the Mechanism Modeling of the Mechanism Avoiding ESD/EOS Failures Latch-Up Description of the Mechanism How to Detect How to Avoid Qualification Qualification Testing Virtual Qualification Screening Functional Tests Burn-In Tests Iddq Tests Design for Reliability Design System Effective Management of Wear-Out Failures Extrinsic Reliability Mechanisms Infant Mortality Failure Mechanisms Circuit Sensitivities Summary

O autorze

Pecht, Michael; Radojcic, Riko; Rao, Gopal