A broad and practical reference to IC socket technology

The first and only comprehensive resource on IC (Integrated Circuit) socket technology, IC Component Sockets offers a complete overview of socket technology and design in order to provide engineers and their managers with a good understanding of these specialized technologies and the processes for evaluating them. The authors, both acknowledged experts in the field, address all relevant aspects of the subject-including materials, design, performance characteristics, failure modes and mechanisms, and qualification and...

Increase profitability and reduce risk through effective parts selection and management

Corporations recognize that technology can be the key to fueling product design and development. But just as crucial-if not more-to a company's success are the decisions about when, what, and how a technology will be used. Few companies have failed because the right technology was not available; many have failed when a technology was not effectively selected and managed.

Parts Selection and Management is a guide to increasing company profitability and reducing the time-to-profit...

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances.

This text covers the major segments of the electronics industry in China - semiconductors, packaging, displays, printed circuit boards, and electronic systems. In addition, it examines the roles that governments, associations, research organizations, educational institutions, and major companies have played in establishing an infrastructure where the industry can flourish.

Presents scientific basis for achieving system operation without reliability penalties at realistic steady state temperatures. From a physics-of-failure perspective, this book explores the temperature effects on electrical parameters of both bipolar and MOSFET devices and identifies models for quantifying temperature effects on package elements.

This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of products.

Examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This book provides a framework for how to model the mechanism, test for defects, and avoid and manage damage.

The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk in engineering problems.