Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach

ISBN-13: 9780849394508 / Angielski / Twarda / 1997 / 336 str.

Lall; Lall Lall; Michael G. Pecht

Opis

Presents scientific basis for achieving system operation without reliability penalties at realistic steady state temperatures. From a physics-of-failure perspective, this book explores the temperature effects on electrical parameters of both bipolar and MOSFET devices and identifies models for quantifying temperature effects on package elements.

Spis treści

Does the Cooling of Electronics Increase Reliability?
Temperature Dependence of Microelectronic Package Failure Mechanisms
Temperature Dependencies of Failure Mechanisms in the Die Metallization
Effect of Hydrogen (H2) and Helium (He) Ambients On Metallization Versus Temperature
Temperature Dependencies of Failure Mechanisms in the Device Oxide
Temperature Dependencies of Failure Mechanisms in the Device
Temperature Dependencies of Failure Mechanisms in the Device Oxide Interface
Temperature Dependence of Microelectronic Package Failure Mechanisms
Temperature Dependencies of Failure Mechanisms in the Die and Die/Substrate Attach
Temperature Dependencies of Failure Mechanisms in First-Level Interconnections
Temperature Dependencies of Failure Mechanisms in the Package Case
Electrical Parameter Variations in Bipolar Devices
Introduction
Temperature Dependence of Bipolar Junction Transistor Parameters
Electrical Parameter Variations in Mosfet Devices
Temperature Dependence of Mosfet Parameters
A Physics-of-Failure Approach to IC Burn-In
Introduction
Burn-In Philosophy
Problems with Present Approach to Burn-In
A Physics-of-Failure Approach to Burn-In
Derating Guidelines for Temperature-Tolerant Design of Microelectronic Devices
Introduction
Problems with the Present Approach to Device Derating
A Physics-of-Failure Approach to Device Derating
Derating for Failure Mechanisms in Die Metallization
Derating Guidelines for Temperature-Tolerant Design of Electronic Packages
Derating for Failure Mechanisms in the Die and Die/Substrate Attach
Derating for Failure Mechanisms in the First-Level Interconnects
Derating for Failure Mechanisms in the Package Case
A Guide for Steady State Temperature Effects

O autorze

Lall, Pradeep; Pecht, Michael; Hakim, Edward B.