Soldering Processes and Equipment

ISBN-13: 9780471591672 / Angielski / Twarda / 1993 / 312 str.

Michael G. Pecht; Michael Pecht

Opis

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances.

Spis treści

Solders, Solder Fluxes, and Solder Pastes.

Wave Soldering.

Reflow Soldering.

Cleaning and Contamination.

Reliability and Quality.

Rework, Repair, and Manual Assembly.

Appendix.

Glossary of Soldering Terms.

Index.