Kategoria BISAC: Technology & Engineering >> Metallurgy

Despite decades of extensive research and application, commercial aluminum alloys are still poorly understood in terms of the phase composition and phase transformations occurring during solidification, cooling, and heating.

Multicomponent Phase Diagrams: Applications for Commercial Aluminum Alloys aims to apply multi-component phase diagrams to commercial aluminum alloys, and give a comprehensive coverage of available and assessed phase diagrams for aluminum-based alloy systems of different dimensionality.

• Features data on non-equilibrium phase diagrams,...

In the last few years, a significant increase in applications of MMCs has taken place, particularly in the areas of automotive, aerospace, electronics, and recreation. These include continuous fiber reinforced MMCs for cables in power transmission, high temperature superconducting wires, particulate MMCs in civilian aircraft and automotive applications, and high volume fraction, high thermal conductivity substrates for electronic packaging. Nevertheless, as with any novel material systems, there is a lack of fundamental understanding on the part of practicing engineers and designers. This...

One of the key aspects of this volume is to cut across the traditional taxonomy of disciplines in the study of alloys. Hence there has been a deliberate attempt to integrate the different approaches taken towards alloys as a class of materials in different fields, ranging from geology to metallurgical engineering. The emphasis of this book is to highlight commonalities between different fields with respect to how alloys are studied. The topics in this book fall into several themes, which suggest a number of different classification schemes. We have chosen a scheme that classifies the...

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1^st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint...

Applications of the results are given in numerous worked examples within the text. Conclusions on how to avoid cracks, solidification pores, slag inclusions and other defects of the castings, can be drawn from the theoretical models....

Applications of the results are given in numerous worked examples within the text. Conclusions on how to avoid cracks, solidification pores, slag inclusions and other defects of the castings, can be drawn from the theoretical models....