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Kategorie szczegółowe BISAC
 Solder Joint Technology: Materials, Properties, and Reliability Tu, King-Ning 9780387388908 Springer
Solder Joint Technology: Materials, Properties, and Reliability

Tu, King-Ning

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint...

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these produc...

cena: 887,69
 Electronic Thin-Film Reliability King-Ning Tu 9780521516136 CAMBRIDGE UNIVERSITY PRESS
Electronic Thin-Film Reliability

King-Ning Tu
Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving...
Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, ...
cena: 283,56
 Solder Joint Technology: Materials, Properties, and Reliability Tu, King-Ning 9781441922847 Not Avail
Solder Joint Technology: Materials, Properties, and Reliability

Tu, King-Ning

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint...

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these produc...

cena: 887,69
 Silicon and Silicide Nanowires: Applications, Fabrication, and Properties Huang, Yu 9789814303460 Pan Stanford Publishing
Silicon and Silicide Nanowires: Applications, Fabrication, and Properties

Huang, Yu

Nanoscale materials are showing great promise in various electronic, optoelectronic, and energy applications. Silicon (Si) has especially captured great attention as the leading material for microelectronic and nanoscale device applications. Recently, various silicides have garnered special attention for their pivotal role in Si device engineering and for the vast potential they possess in fields such as thermoelectricity and magnetism. The fundamental understanding of Si and silicide material processes at nanoscale plays a key role in achieving device structures and performance that meet...

Nanoscale materials are showing great promise in various electronic, optoelectronic, and energy applications. Silicon (Si) has especially captured ...

cena: 560,94


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