Kategoria BISAC: Technology & Engineering >> Industrial Design - Packaging

Packaging design is a powerful vehicle for making our lives friendlier, our planet greener and our businesses richer. It is an essential link between the producer and the customer, where it contributes to the positioning and presentation of a product; and on many occasions, the use of the product after purchase. What is missing is a compass that can guide practitioners in the right direction. This is particularly so in the field of packaging where the routes you take may contradict rather than contribute to sustainable development.

Managing Packaging Design for Sustainable...

Food Packaging Nanotechnology in the Agri-Food Industry, Volume 7, focuses on the development of novel nanobiomaterials, the enhancement of barrier performance of non-degradable and biodegradable plastics, and their fabrication and application in food packaging.

The book brings together fundamental information and the most recent advances in the synthesis, design, and impact of alternative food packaging. Special attention is offered on smart materials and nanodevices that are able to detect quality parameters in packaged food, such as freshness, degradation, and...

Many factors are relevant in making the proper choice of food packaging material, including those related to shelf life and biodegradability. To meet these demands, new processing and preservation techniques have arisen, most notably modified atmosphere packaging (MAP) and active packaging (AP). Modified Atmosphere and Active Packaging Technologies presents an overview of the current status of MAP and AP, exploring techniques, methodologies, applications, and relevant legislation.

For clarity and easy reference, the book is divided into seven convenient...

Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks

This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker...

Focusing on materials technology for integrated circuit (IC) packaging, this comprehensive overview of semiconductor packaging materials also provides a working introduction to related subjects such as package form factors, interconnection technology, QA&R, and board assembly. It covers MEMS, solar, and LEDs, and considers the interaction of package materials on device performance and assembly technology. Accessible to newcomers as well as professionals, this book discusses the reliability tests and analytical tools necessary and touches on future trends in semiconductor packaging...