Semiconductor Packaging: Materials Interaction and Reliability

ISBN-13: 9781138075405 / Angielski / Miękka / 2017 / 216 str.

Andrea Chen; Randy Hsiao Lo

Opis

This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Spis treści

SEMICONDUCTOR PACKAGES: History and Background. Package Form Factors and Families. Surface-Mount Technology. Other Packaging Needs. PACKAGE RELIABILITY: Reliability Testing. MATERIALS USED IN SEMICONDUCTOR PACKAGING: Polymers. Metals. Ceramics and Glasses. THE FUTURE: Trends and Challenges. Light-Emitting Diodes. Appendices. Index.