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Kategoria BISAC: Technology & Engineering >> Industrial Design - Packaging
ilość książek w kategorii: 144
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Sustainable Packaging Materials
ISBN: 9781569901625 / Angielski / Twarda / 91 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. "Sustainable Packaging Materials" provides a concise introduction to the principles and practices of packaging sustainability. It addresses the important issues that concern packaging professionals, decision makers, managers, CTOs, legislators, researchers, and students, including the viability and future of recycling, bio- and oxo-degradable materials, and plastics alternatives such as paper, glass, and metal. Also covered are new regulations such as the extended producer responsibility (EPR) laws, their consequences as to what materials are likely to be banned, and whether microplastics...
"Sustainable Packaging Materials" provides a concise introduction to the principles and practices of packaging sustainability. It addresses the import...
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cena:
433,57 zł |
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Electronic Packaging and Interconnection Handbook 4/E
ISBN: 9780071430487 / Angielski / Twarda / 1000 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Provides a comprehensive reference in electronic packaging. This title offers a source of key reference data, practical guidance, and circuit and package design basics. It is intended for mechanical and electrical engineers, chemists, physicists, and materials scientists in various areas of the electronic packaging industry.
Provides a comprehensive reference in electronic packaging. This title offers a source of key reference data, practical guidance, and circuit and pack...
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cena:
1223,04 zł |
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A Handbook of Food Packaging
ISBN: 9780216932104 / Angielski / Twarda / 497 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This is the second edition of a successful title first published in 1983 and now therefore a decade out of date. The authors consider the development of the right package for a particular food in a particular market, from the point of view of the food technologist, the packaging engineer and those concerned with marketing. While the original format has been retained, the contents have been thoroughly revised to take account of the considerable advances made in recent years in the techniques offood processing, packaging and distribution. While efficient packaging is even more a necessity for...
This is the second edition of a successful title first published in 1983 and now therefore a decade out of date. The authors consider the development ...
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cena:
780,00 zł |
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Nanopackaging: Nanotechnologies and Electronics Packaging
ISBN: 9780387473253 / Angielski / Twarda / 568 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive inks, underfill fillers, and solder enhancement. Nanopackaging is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in... Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitat... |
cena:
780,00 zł |
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Microelectronics Packaging Handbook: Semiconductor Packaging
ISBN: 9780412084416 / Angielski / Twarda / 1030 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical...
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a coun...
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cena:
1365,04 zł |
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
ISBN: 9780412084515 / Angielski / Twarda / 628 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation...
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics des...
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cena:
585,00 zł |
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Failure Modes and Mechanisms in Electronic Packages
ISBN: 9780412105913 / Angielski / Twarda / 396 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Those of us who grew up in the "through-hole" age of electronic packaging are probably more amazed and appreciative than are our children at the incredible growth of electronic performance capability. My son, an electrical engineering student, seems almost to take for granted the innovations that leave me somewhat awestruck at times. Electronic circuit designers delight in packing more punch into less volume, while reminding us that their job has become increasingly challenging. The lay person also has learned from the media that the industry has been working wonders in shrinking the...
Those of us who grew up in the "through-hole" age of electronic packaging are probably more amazed and appreciative than are our children at the incre...
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cena:
585,00 zł |
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Flexible Food Packaging: Questions and Answers
ISBN: 9780442006099 / Angielski / Miękka / 216 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Packaging is an essential feature of modern life. The science and art of packaging is so vast that no single book or even a multivolume work could hope to cover the entire scope of topics, from Artwork to Zipper. This volume has selected some of the most commonly raised questions in the field of flexible packaging of food. No claim is made for comprehensive coverage of the field-nor even for an in-depth exploration of a limited number of topics. The novice should find sufficient material here to gain a broad understanding of flexible packaging. The expert's knowledge may be enriched by the...
Packaging is an essential feature of modern life. The science and art of packaging is so vast that no single book or even a multivolume work could hop...
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cena:
389,98 zł |
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Preventing Thermal Cycling and Vibration Failures in Electronic Equipment
ISBN: 9780471357292 / Angielski / Twarda / 304 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.
This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.
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cena:
691,66 zł |
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He Said, She Said: A Father-Daughter Perspective
ISBN: 9780595369911 / Angielski / Miękka / 224 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Based on Ken & Jasmyn Kaye's experiences from Jasmyn's early childhood to present day, "He Said, She Said: A Father-Daughter Perspective" offers a unique view of this sometimes difficult relationship. Since Kaye's daughter exhibited the qualities of an out-of-control teen, it took perseverance and patience to learn how to understand her perspective. "He Said, She Said" offers a distinctive format by recounting events-from childhood to adolescence-from both the father and daughter's point of view. These differing viewpoints effectively tell both sides of the story and give you an inside look...
Based on Ken & Jasmyn Kaye's experiences from Jasmyn's early childhood to present day, "He Said, She Said: A Father-Daughter Perspective" offers a uni...
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cena:
82,77 zł |
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Active Food Packaging
ISBN: 9780751401912 / Angielski / Twarda / 260 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Food packaging materials have traditionally been chosen to avoid unwanted interactions with the food. During the past two decades a wide variety of packaging materials have been devised or developed to interact with the food. These packaging materials, which are designed to perform some desired role other than to provide an inert barrier to outside influences, are termed 'active packaging'. The benefits of active packaging are based on both chemical and physical effects. Active packaging concepts have often been presented to the food industry with few supporting results of background...
Food packaging materials have traditionally been chosen to avoid unwanted interactions with the food. During the past two decades a wide variety of pa...
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cena:
389,98 zł |
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Food Packaging Science and Technology
ISBN: 9780824727796 / Angielski / Twarda / 656 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. With a wealth of illustrations, examples, discussion questions, and case studies, the Food Packaging Science and Technology covers basic principles and technologies as well as advanced topics such as active, intelligent, and sustainable packaging with unparalleled depth and breadth of scope. Emphasizing the application of relevant scientific principles to create effective designs and quality products, an international team of contributors draws on their collective experience to equip you with the necessary knowledge and tools to tackle modern food packaging problems.
Divided into... With a wealth of illustrations, examples, discussion questions, and case studies, the Food Packaging Science and Technology covers basic princi...
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cena:
626,03 zł |
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Electronic Packaging Materials and Their Properties
ISBN: 9780849396250 / Angielski / Twarda / 128 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This text focuses on the use of materials and the reliability issues associated with them and their interfaces. Included is a review of the key electrical, thermal, mechanical, chemical and various other properties and their significance in electronic packaging. Electronic packaging architectures are covered: Zeroth-level packaging materials; first-level; second level; and third level. The authors show how the levels of packaging or packaging architectures are used to classify materials and their performance over time.
This text focuses on the use of materials and the reliability issues associated with them and their interfaces. Included is a review of the key electr...
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cena:
808,63 zł |
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Active Packaging for Food Applications
ISBN: 9781587160455 / Angielski / Twarda / 236 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Based on thousands of citations from peer-reviewed, trade, commercial, and patent literature and interviews with those who have worked in the laboratory, in pilot plants, and in production, Active Packaging for Food Applications provides a state-of-the-art guide to understanding and utilizing these technologies. The book highlights technologies that are currently in commercial use or have the potential to become commercial, including oxygen scavenging, moisture control, ethylene removal from fresh food, antimicrobials, odor removal, and aroma emission. In addition, it explores the pros and...
Based on thousands of citations from peer-reviewed, trade, commercial, and patent literature and interviews with those who have worked in the laborato...
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cena:
1304,24 zł |
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Modified Atmosphere and Active Packaging Technologies
ISBN: 9781439800447 / Angielski / Twarda / 826 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Many factors are relevant in making the proper choice of food packaging material, including those related to shelf life and biodegradability. To meet these demands, new processing and preservation techniques have arisen, most notably modified atmosphere packaging (MAP) and active packaging (AP). Modified Atmosphere and Active Packaging Technologies presents an overview of the current status of MAP and AP, exploring techniques, methodologies, applications, and relevant legislation. For clarity and easy reference, the book is divided into seven convenient... Many factors are relevant in making the proper choice of food packaging material, including those related to shelf life and biodegradability. To me... |
cena:
1199,90 zł |
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Pharmaceutical Packaging Technology
ISBN: 9780748404407 / Angielski / Twarda / 646 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Pharmaceutical packaging is regarded as an integral part of the end pharmaceutical/drug product. This text is structured to meet the needs of the global market, and assesses a wide range of current knowledge, catering both for the requirements of the pharmaceutical industry in the 1990s, as well as for pharmaceutical companies in emerging nations who are still seeking a basic grounding in the subject. The author integrates information on many drug delivery systems, where the packaging is an essential component of the product, to produce a book for all those dealing with the topic.
Pharmaceutical packaging is regarded as an integral part of the end pharmaceutical/drug product. This text is structured to meet the needs of the glob...
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cena:
2738,88 zł |
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Migration from Food Contact Materials
ISBN: 9780751402377 / Angielski / Twarda / 304 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. The advent of sophisticated packaging materials and methods had stimulated the development of complex delivery systems from producer to consumer, resulting in the availability of a wide range of products at an affordable price. Contemporary distribution methods are not without problems however, and specifically related to packaging is the possibility of migration--the contamination of food by components of the materials in contact with it. In this area, both technology and regulations are well developed, but basic science, for a variety of reasons, has tended to advance less quickly. This...
The advent of sophisticated packaging materials and methods had stimulated the development of complex delivery systems from producer to consumer, resu...
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cena:
585,00 zł |
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Food Packaging: Materiali, Tecnologie E Qualita Degli Alimenti
ISBN: 9788847014565 / Włoski / Miękka / 578 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Il volume e rivolto agli studenti universitari dei corsi di Laurea in Scienze e Tecnologie Alimentari, Scienze e Tecnologie Agrarie e Scienze e Tecnologie della Ristorazione che devono acquisire nei loro studi conoscenze, competenze e abilita relative all'ambito multidisciplinare del confezionamento di alimenti e bevande. Lo scopo dell'opera e pero anche quello di rendere disponibile un testo di utilita piu ampia e generale, indirizzato ai tecnici e agli operatori che nelle aziende di produzione di alimenti, o di imballaggi per alimenti, sono interessati ad un approfondimento e ad un... Il volume e rivolto agli studenti universitari dei corsi di Laurea in Scienze e Tecnologie Alimentari, Scienze e Tecnologie Agrarie e Scienze e Tec... |
cena:
213,58 zł |
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Microelectronics Packaging Handbook: Technology Drivers Part I
ISBN: 9780412084317 / Angielski / Twarda / 752 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical...
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a coun...
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cena:
780,00 zł |
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Migration from Food Contact Materials
ISBN: 9781461285205 / Angielski / Miękka / 304 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. The advent of sophisticated packaging materials and methods had stimulated the development of complex delivery systems from producer to consumer, resulting in the availability of a wide range of products at an affordable price. Contemporary distribution methods are not without problems however, and specifically related to packaging is the possibility of migration--the contamination of food by components of the materials in contact with it. In this area, both technology and regulations are well developed, but basic science, for a variety of reasons, has tended to advance less quickly. This...
The advent of sophisticated packaging materials and methods had stimulated the development of complex delivery systems from producer to consumer, resu...
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cena:
585,00 zł |
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