This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.

This book deals with the analysis of various types of vibration environments that can lead to the failure of electronic systems or components.

Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.