Electronic Packaging Materials and Their Properties

ISBN-13: 9780849396250 / Angielski / Twarda / 1998 / 128 str.

Michael Pecht; Rakesh Agarwal; Patrick McCluskey

Opis

This text focuses on the use of materials and the reliability issues associated with them and their interfaces. Included is a review of the key electrical, thermal, mechanical, chemical and various other properties and their significance in electronic packaging. Electronic packaging architectures are covered: Zeroth-level packaging materials; first-level; second level; and third level. The authors show how the levels of packaging or packaging architectures are used to classify materials and their performance over time.

Spis treści

Introduction
Properties of Electronics Packaging Materials
Electrical Properties
Thermal and Thermomechanical Properties
Mechanical Properties
Chemical Properties
Miscellaneous Properties
Zeroth-Level Packaging Materials
Semiconductors
Attachment Materials
Substrates
First-Level Packaging Materials
Wire Interconnects
Tape Interconnects
Case Materials
Lid Seals
Leads
Second-Level Packaging Materials
Reinforcement Fiber Materials
Resins
Laminates
Constraining Cores
Flexible Wiring Board Materials
Conductor Metals in Laminates
Conformal Coatings
Third-Level Packaging Materials
Backpanel Materials
Connectors Materials
Cables and Flex Circuit Materials
Summary
Appendices
Index

O autorze

Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan