Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive inks, underfill fillers, and solder enhancement. Nanopackaging is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in...
Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitat...
Graphene, Carbon Nanotubes, and Nanostructures: Techniques and Applications offers a comprehensive review of groundbreaking research in nanofabrication technology and explores myriad applications that this technology has enabled.The book examines the historical evolution and emerging trends of nanofabrication and supplies an analytical understanding of some of the most important underlying nanofabrication technologies, with an emphasis on graphene, carbon nanotubes (CNTs), and nanowires.
Featuring contributions by experts from academia and industry around...
Graphene, Carbon Nanotubes, and Nanostructures: Techniques and Applications offers a comprehensive review of groundbreaking resear...
Nanoelectronic Device Applications Handbook gives a comprehensive snapshot of the state of the art in nanodevices for nanoelectronics applications. Combining breadth and depth, the book includes 68 chapters on topics that range from nano-scaled complementary metal oxide semiconductor (CMOS) devices through recent developments in nano capacitors and AlGaAs/GaAs devices. The contributors are world-renowned experts from academia and industry from around the globe.
The handbook explores current research into potentially disruptive technologies for a post-CMOS world....
Nanoelectronic Device Applications Handbook gives a comprehensive snapshot of the state of the art in nanodevices for nanoelectron...
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics...
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New Yor...
This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based on that year's presentations at the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T. J. Watson School of Engineering, Applied Science and Technology in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (University-Industry Partnership for Economic Growth. ) Electronics Packaging has been receiving significant...
This is the first volume of an annual monographic series devoted to the diverse aspects of electronics packaging technology. Each book is to be based ...
This book presents a comprehensive overview of nanoscale electronics and systems packaging, covering nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. It is intended for industrial and academic researchers, and industrial electronics packaging engineers.
This book presents a comprehensive overview of nanoscale electronics and systems packaging, covering nanoscale structures, nanoelectronics packaging, ...
