Kategoria BISAC: Technology & Engineering >> Industrial Design - Packaging

Food Packaging Nanotechnology in the Agri-Food Industry, Volume 7, focuses on the development of novel nanobiomaterials, the enhancement of barrier performance of non-degradable and biodegradable plastics, and their fabrication and application in food packaging.

The book brings together fundamental information and the most recent advances in the synthesis, design, and impact of alternative food packaging. Special attention is offered on smart materials and nanodevices that are able to detect quality parameters in packaged food, such as freshness, degradation, and...

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Efficiently and profitably delivering quality flexible packaging to the marketplace requires designing and manufacturing products that are both "fit-to-use" and "fit-to-make." The engineering function in a flexible packaging enterprise must attend to these dual design challenges.

Flexible Packaging discusses the basic processes used to manufacture flexible packaging products, including rotogravure printing, flexographic printing, adhesive lamination, extrusion lamination/coating; and finishing/slitting. These processes are then related to the machines used to practice them,...

Design, development and life-cycle management of any electromechanical product is a complex task that requires a cross-functional team spanning multiple organizations, including design, manufacturing, and service. Ineffective design techniques, combined with poor communication between various teams, often leads to delays in product launches, with last minute design compromises and changes. The purpose of Design of Electromechanical Products: A Systems Approach is to provide a practical set of guidelines and best practices for driving world-class design, development, and...

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive inks, underfill fillers, and solder enhancement. Nanopackaging is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in...