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wyszukanych pozycji: 25
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Handbook of Electronic Package Design
ISBN: 9780824779214 / Angielski / Twarda / 1991 / 904 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Presents a treatment that begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development. It is both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques.
Presents a treatment that begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the...
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cena:
2098,74 zł |
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Guidebook for Managing Silicon Chip Reliability
ISBN: 9780849396243 / Angielski / Twarda / 1998 / 224 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This book provides a framework for how to model the mechanism, test for defects, and avoid and manage damage.
Examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This book pr...
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cena:
550,92 zł |
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Placement and Routing of Electronic Modules
ISBN: 9780367402426 / Angielski / Miękka / 2019 / 352 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. |
cena:
325,25 zł |
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The Chinese Electronics Industry
ISBN: 9781138434646 / Angielski / Twarda / 2017 / 192 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. |
cena:
944,43 zł |
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The Korean Electronics Industry
ISBN: 9781138434660 / Angielski / Twarda / 2018 Termin realizacji zamówienia: ok. 16-18 dni roboczych. |
cena:
629,62 zł |
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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
ISBN: 9780471594468 / Angielski / Twarda / 1994 / 464 str. Termin realizacji zamówienia: ok. 22 dni roboczych. Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.
Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost *... Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-...
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cena:
911,02 zł |
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Placement and Routing of Electronic Modules
ISBN: 9780824789169 / Angielski / Twarda / 1993 / 352 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving specific problems.;Focusing on highly reliable methods for good manufacturing capability, Placement and Routing of Electronic Modules: discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories; explicates the definitions, structures and relationships of tree types and gives methods of finding minimum trees; furnishes useful techniques for placing and routing high-density modules; supplies...
This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to s...
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cena:
1364,18 zł |
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Parts Selection and Management
ISBN: 9780471476054 / Angielski / Twarda / 2004 / 340 str. Termin realizacji zamówienia: ok. 22 dni roboczych. Increase profitability and reduce risk through effective parts selection and management
Corporations recognize that technology can be the key to fueling product design and development. But just as crucial-if not more-to a company's success are the decisions about when, what, and how a technology will be used. Few companies have failed because the right technology was not available; many have failed when a technology was not effectively selected and managed. Parts Selection and Management is a guide to increasing company profitability and reducing the time-to-profit... Increase profitability and reduce risk through effective parts selection and management
Corporations recognize that technology can be the... |
cena:
723,24 zł |
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The Korean Electronics Industries
ISBN: 9780849331725 / Angielski / Miękka / 1997 / 138 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. The Korean Electronics Industry documents the technologies, manufacturing procedures, capabilities, and infrastructure that have made the Republic of Korea successful in the electronics industry. The book covers the major segments of Korea's electronics industry, including semiconductors, packaging, displays, printed circuit boards, and systems. In addition, this book examines the roles that government, associations, research organizations, educational institutions, and major companies have played in establishing an infrastructure where the industry can flourish.
The Korean Electronics Industry documents the technologies, manufacturing procedures, capabilities, and infrastructure that have made the Republic of ...
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cena:
272,78 zł |
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China's Electronics Industry: The Definitive Guide for Companies and Policy Makers with Interest in China
ISBN: 9780815515364 / Angielski / Miękka / 2006 / 265 str. Termin realizacji zamówienia: ok. 18-20 dni roboczych. China's Electronics Industry is a comprehensive and current report on the technologies, manufacturing capabilities, and infrastructure that have made China a major player in the electronics industry. Not only does it cover the past, present, and future of important electronic technologies, but also the pros and cons of conducting business in China. This is an important reference for any company planning a venture in China as well as those who have already taken their first steps. It will also be of great interest to researchers and policy makers who need to know more about the role of central...
China's Electronics Industry is a comprehensive and current report on the technologies, manufacturing capabilities, and infrastructure that have made ...
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cena:
1442,89 zł |
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Electronics Industry in Taiwan
ISBN: 9781138434639 / Angielski / Twarda / 2020 / 170 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Taiwan's electronics industry, especially the semiconductor and information products sectors, is characterized by rapid growth and high potential. This book investigates the past performance, current status, and future development of this industry, providing engineers with important data. Corporate business planners and electronics managers will find helpful information for decision making regarding joint ventures and alliances with Taiwanese manufacturers.
Taiwan's electronics industry, especially the semiconductor and information products sectors, is characterized by rapid growth and high potential. Thi...
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cena:
865,74 zł |
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Soldering Processes and Equipment
ISBN: 9780471591672 / Angielski / Twarda / 1993 / 312 str. Termin realizacji zamówienia: ok. 22 dni roboczych. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances.
Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic cir...
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cena:
761,90 zł |
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IC Component Sockets
ISBN: 9780471460503 / Angielski / Twarda / 2004 / 232 str. Termin realizacji zamówienia: ok. 13-18 dni roboczych (Dostawa przed świętami) A broad and practical reference to IC socket technology
The first and only comprehensive resource on IC (Integrated Circuit) socket technology, IC Component Sockets offers a complete overview of socket technology and design in order to provide engineers and their managers with a good understanding of these specialized technologies and the processes for evaluating them. The authors, both acknowledged experts in the field, address all relevant aspects of the subject-including materials, design, performance characteristics, failure modes and mechanisms, and qualification and... A broad and practical reference to IC socket technology
The first and only comprehensive resource on IC (Integrated Circuit) socket techn... |
cena:
669,98 zł |
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Prognostics and Health Management of Electronics: Fundamentals, Machine Learning, and the Internet of Things
ISBN: 9781119515333 / Angielski / Twarda / 2018 / 800 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
cena:
717,72 zł |
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Guidebook for Managing Silicon Chip Reliability
ISBN: 9780367400064 / Angielski / Miękka / 2019 / 224 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?Chapters discuss:failure sites, operational loads, and failure...
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualificat...
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cena:
209,82 zł |
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Advanced Routing of Electronic Modules
ISBN: 9780849396229 / Angielski / Twarda / 1995 / 480 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of products.
This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of products.
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cena:
865,74 zł |
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Electronic Packaging Materials and Their Properties
ISBN: 9780849396250 / Angielski / Twarda / 1998 / 128 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. This text focuses on the use of materials and the reliability issues associated with them and their interfaces. Included is a review of the key electrical, thermal, mechanical, chemical and various other properties and their significance in electronic packaging. Electronic packaging architectures are covered: Zeroth-level packaging materials; first-level; second level; and third level. The authors show how the levels of packaging or packaging architectures are used to classify materials and their performance over time.
This text focuses on the use of materials and the reliability issues associated with them and their interfaces. Included is a review of the key electr...
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cena:
813,27 zł |
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Encapsulation Technologies for Electronic Applications
ISBN: 9780128119785 / Angielski / Miękka / 2018 / 508 str. Termin realizacji zamówienia: ok. 18-20 dni roboczych. |
cena:
965,42 zł |
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Contamination of Electronic Assemblies
ISBN: 9780849314834 / Angielski / Twarda / 2002 / 232 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of Electronic Assemblies presents a generalized overview of contamination problems and serves as a problem-solving reference point. It takes a step-by-step approach to identifying contaminants and their effects on electronic products at each level of...
Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understandi...
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cena:
1311,71 zł |
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Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
ISBN: 9780367400972 / Angielski / Miękka / 2019 / 336 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. |
cena:
209,82 zł |
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