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wyszukanych pozycji: 9
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Between The Dragons
ISBN: 9781637100622 / Angielski / Miękka / 2021 / 302 str. Termin realizacji zamówienia: ok. 13-18 dni roboczych (Dostawa przed świętami) |
cena:
87,14 zł |
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Managing More-Than-Moore Integration Technology Development: A Story of an Advanced Technology Program in the Semiconductor Industry
ISBN: 9783319927008 / Angielski / Twarda / 2018 / 211 str. Termin realizacji zamówienia: ok. 20 dni roboczych. This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program - but using a novelized form.
This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program - but usin...
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cena:
128,96 zł |
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Managing More-Than-Moore Integration Technology Development: A Story of an Advanced Technology Program in the Semiconductor Industry
ISBN: 9783030064952 / Angielski / Miękka / 2019 / 211 str. Termin realizacji zamówienia: ok. 20 dni roboczych. |
cena:
128,96 zł |
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Between the Titans
ISBN: 9781646541775 / Angielski / Miękka / 2020 / 290 str. Termin realizacji zamówienia: ok. 13-18 dni roboczych (Dostawa przed świętami) |
cena:
87,14 zł |
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More-Than-Moore 2.5d and 3D Sip Integration
ISBN: 9783319525471 / Angielski / Twarda / 2017 / 182 str. Termin realizacji zamówienia: ok. 20 dni roboczych. This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology... This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore s Law regime. Te... |
cena:
469,06 zł |
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More-Than-Moore 2.5d and 3D Sip Integration
ISBN: 9783319849324 / Angielski / Miękka / 2018 / 182 str. Termin realizacji zamówienia: ok. 20 dni roboczych. |
cena:
332,24 zł |
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FA Confidential
ISBN: 9781948598637 / Angielski Termin realizacji zamówienia: ok. 13-18 dni roboczych (Dostawa przed świętami) |
cena:
91,50 zł |
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Guidebook for Managing Silicon Chip Reliability
ISBN: 9780367400064 / Angielski / Miękka / 2019 / 224 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?Chapters discuss:failure sites, operational loads, and failure...
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualificat...
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cena:
209,82 zł |
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Guidebook for Managing Silicon Chip Reliability
ISBN: 9780849396243 / Angielski / Twarda / 1998 / 224 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This book provides a framework for how to model the mechanism, test for defects, and avoid and manage damage.
Examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This book pr...
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cena:
550,92 zł |
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