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This text focuses on the use of materials and the reliability issues associated with them and their interfaces. Included is a review of the key electrical, thermal, mechanical, chemical and various other properties and their significance in electronic packaging. Electronic packaging architectures are covered: Zeroth-level packaging materials; first-level; second level; and third level. The authors show how the levels of packaging or packaging architectures are used to classify materials and their performance over time.

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them.Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above...

High Temperature Electronics brings together essential information on the development of electronic components and packaging reliable to 200 degreeC and beyond and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate.level courses...