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Wer ist fur Gesundheitsschaden, die durch Arzneimittel entstehen, konkret zur Verantwortung zu ziehen? Der Autor untersucht insbesondere die strafrechtliche Verantwortung der Arzneimittelproduzenten, aber auch die der behandelnden Arzte, Apotheker sowie der staatlichen Stellen, die die klinische Arzneimittelprufung reglementieren. Ein umfassendes Nachschlagewerk fur alle Beteiligten zur Vermeidung von Indikations-, Abgabe- und Therapiefehlern. "

Der Band prasentiert eine Bestandsaufnahme der Forschung nach der Debatte um die Studie "Das Amt und die Vergangenheit." Was wissen wir wirklich uber das Auswartige Amt im Nationalsozialismus, wo liegen die Desiderate, was ist in Arbeit, was unbestritten, was umstritten? Der Band gibt eine Antwort auf die Frage, wie sich dieser Streit zwischen Historikern in die Entwicklung der Forschung einordnen lasst und welche Impulse von ihm ausgehen konnen.

Don t miss it The second, completely revised and expanded edition of the successful surgical manual on minimally invasive spine surgery includes 51 chapters (including more than 20 new chapters) covering all current minimally invasive techniques in spine surgery. A complete survey of all microsurgical and endoscopic techniques with a special focus on semi-invasive injection techniques for diagnostic and therapeutic purposes in low back pain is given. The clear chapter structure with terminology, history, surgical principles, advantages/disadvantages, indications, access principles,...

Don t miss it The second, completely revised and expanded edition of the successful surgical manual on minimally invasive spine surgery includes 51 chapters (including more than 20 new chapters) covering all current minimally invasive techniques in spine surgery. A complete survey of all microsurgical and endoscopic techniques with a special focus on semi-invasive injection techniques for diagnostic and therapeutic purposes in low back pain is given. The clear chapter structure with terminology, history, surgical principles, advantages/disadvantages, indications, access principles,...

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the...