Force Sensors for Microelectronic Packaging Applications

ISBN-13: 9783642060632 / Angielski / Miękka / 2010 / 178 str.

Jurg Schwizer; Michael Mayer; Oliver Brand

Opis

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Spis treści

Sensor Design.- Measurement System.- Characterization.- Applications.- Conclusions and Outlook.

O autorze

Oliver Brand is Professor of Bioengineering and Microelectronics/Microsystems at Georgia Institute of Technology, Atlanta, USA. He received his diploma degree in Physics from Technical University Karlsruhe, Germany, in 1990, and his PhD from ETH Zurich, Switzerland, in 1994. Between 1995 and 2002, he held research and teaching positions at the Georgia Institute of Technology (1995-1997) and ETH Zurich (1997-2002). Oliver Brand's research interest is in the areas of CMOS-based micro- and nanosystems, MEMS fabrication technologies, and microsystem packaging.

Blurb

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.