ilość książek w kategorii: 1709
Semiconductor Interfaces: Formation and Properties: Proceedings of the Workkshop, Les Houches, France February 24-March 6, 1987
ISBN: 9783642729690 / Angielski / Miękka / 389 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. The trend towards miniaturisation of microelectronic devices and the search for exotic new optoelectronic devices based on multilayers confer a crucial role on semiconductor interfaces. Great advances have recently been achieved in the elaboration of new thin film materials and in the characterization of their interfacial properties, down to the atomic scale, thanks to the development of sophisticated new techniques. This book is a collection of lectures that were given at the International Winter School on Semiconductor Interfaces: Formation and Properties held at the Centre de Physique des...
The trend towards miniaturisation of microelectronic devices and the search for exotic new optoelectronic devices based on multilayers confer a crucia...
|
|
cena:
382,84 zł |
Amorphous and Crystalline Silicon Carbide II: Recent Developments Proceedings of the 2nd International Conference, Santa Clara, Ca, December 15--16, 1
ISBN: 9783642750502 / Angielski / Miękka / 232 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This volume contains written versions of the papers presented at the Second Inter national Conference on Amorphous and Crystalline Silicon Carbide and Related Materials (ICACSC 1988), which was held at Santa Clara University on Decem ber 15 and 16, 1988. The conference followed the First ICACSC held at Howard University, Washington DC, in December 1987 and continued to provide an in ternational forum for discussion and exchange of ideas and results covering the current status of research on SiC and related materials. ICACSC 1988 attracted 105 participants from five countries. The substantial...
This volume contains written versions of the papers presented at the Second Inter national Conference on Amorphous and Crystalline Silicon Carbide and...
|
|
cena:
382,84 zł |
Zeiss Microscopes for Microsurgery
ISBN: 9783642816468 / Angielski / Miękka / 116 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This book has been conceived as a reference for all those who want to deepen their knowledge of technical details, design concept and interac tion of the individual modules of Zeiss operation microscopes. The sub jects of the book are classified in accordance with our intention. Special emphasis has been placed on practical hints for the user of opera tion microscopes to avoid operating errors. Parameters which are of para mount importance for surgeon and assistant such as PD and diopter set ting are therefore described in detail. The effects of wrong adjustments are indicated. The above...
This book has been conceived as a reference for all those who want to deepen their knowledge of technical details, design concept and interac tion of ...
|
|
cena:
382,84 zł |
Radar Target Imaging
ISBN: 9783642851148 / Angielski / Miękka / 195 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Radar imaging, as understood here, involves target recognition, i.e. the determination of the detailed properties of an object (size, shape, structure and composition, and also location and speed) from radar echoes returned by it. Advanced approaches are required for this, and several of recent interest are discussed in this book. They include mathematical inverse-scattering techniques based on the solution of integral equations; use of the singularity expansion method (SEM), related to the resonance scattering theory (RST), in which the pattern of resonance-frequency location in the complex...
Radar imaging, as understood here, involves target recognition, i.e. the determination of the detailed properties of an object (size, shape, structure...
|
|
cena:
382,84 zł |
Polymermechanik: Struktur Und Mechanisches Verhalten Von Polymeren
ISBN: 9783642648588 / Niemiecki / Miękka / 441 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Das Buch gibt einen verstandlichen Uberblick der Zusammenhange zwischen Molekularprozessen und mechanischen Eigenschaften polymerer Substanzen. Der Autor behandelt den Aufbau und die Struktur von Polymeren von einem physikalischen Standpunkt aus. Er stellt die mechanischen und thermischen Eigenschaften der Kunststoffe als Konstruktionsmaterialien, das Deformationsverhalten von vernetzten Kautschuken und das Fliessverhalten von Polymerschmelzen verstandlich dar. Dazu leitet er die zugrundeliegenden Theorien von der Basis her ab und veranschaulicht die Zusammenhange durch experimentelles...
Das Buch gibt einen verstandlichen Uberblick der Zusammenhange zwischen Molekularprozessen und mechanischen Eigenschaften polymerer Substanzen. Der Au...
|
|
cena:
178,88 zł |
Hspa Evolution: The Fundamentals for Mobile Broadband
ISBN: 9780080999692 / Angielski / Twarda / 558 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This book is essential reading for those wishing to obtain a systems perspective and a broad view on the background, performance and application of the latest developments in HSPA in the context of the demands on today's mobile broadband devices and networks. It takes the reader behind the scenes of 3GPP and provides an easily accessible understanding of the basic principles, the latest steps in the standard's evolution, and the motivations behind the development of standardized features. It covers important topics such as smartphone related features, multi-carrier and multi-antenna... This book is essential reading for those wishing to obtain a systems perspective and a broad view on the background, performance and application of... |
|
cena:
430,52 zł |
SIGMA Delta A/D Conversion for Signal Conditioning
ISBN: 9789048171699 / Angielski / Miękka / 278 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. 1.1 Background Moore s Law predicts a decrease by a factor of two in the feature size of CMOS te- nology every three years and has been valid for years. It implies a doubling of the - eration speed and a four times higher transistor count per unit of area, every three years. The combination leads to an eight times higher processing capability per unit of area. This on-going miniaturization allows the integration of complex electronic systems with millions of transistors (Very-Large-Scale-Integration) and enables the integration of el- tronic systems. An electronic system A generic picture of...
1.1 Background Moore s Law predicts a decrease by a factor of two in the feature size of CMOS te- nology every three years and has been valid for year...
|
|
cena:
574,29 zł |
Low Dielectric Constant Materials for IC Applications
ISBN: 9783642632211 / Angielski / Miękka / 310 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite...
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-cons...
|
|
cena:
574,29 zł |
Nonsmooth Modeling and Simulation for Switched Circuits
ISBN: 9789400733855 / Angielski / Miękka / 284 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Complete with examples and simulation results, this volume explores the nonsmooth dynamical systems (NSDS) modeling approach, using piecewise-linear and multivalued models of electronic devices. Readers will find a comparison of SPICE and hybrid methods, which demonstrates the power of the NSDS approach.
Complete with examples and simulation results, this volume explores the nonsmooth dynamical systems (NSDS) modeling approach, using piecewise-linear a...
|
|
cena:
574,29 zł |
Mikromechanik: Mikrofertigung Mit Methoden Der Halbleitertechnologie
ISBN: 9783642466229 / Niemiecki / Miękka / 501 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Mikromechanik behandelt die physikalischen Grundlagen dieser jungen, zukunftstrachtigen Disziplin, ihre Technologie, aufbauend auf der Siliziumtechnologie, und ihre Nutzung in den verschiedensten Anwendungen der Bereiche Sensorik, Aktuatorik und integrierte Optoelektronik. Das Buch ist unentbehrlich fur jeden, der sich intensiv mit der Mikromechanik befassen will; fur den Studierenden ebenso wie fur den Ingenieur in der Praxis oder den interessierten Laien.
Mikromechanik behandelt die physikalischen Grundlagen dieser jungen, zukunftstrachtigen Disziplin, ihre Technologie, aufbauend auf der Silizium...
|
|
cena:
286,24 zł |
International Workshop on Superconducting Nano-Electronics Devices: Sned Proceedings, Naples, Italy, May 28-June 1, 2001
ISBN: 9781461352174 / Angielski / Miękka / 241 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Thisvolumereportsthemajorpartofthescientificcontributionsofthefirstinternational workshoponSuperconductingNano-ElectronicsDevices(SNED)heldinNapoli, Italy, at theendofMay2001. Theaimoftheworkshopwastofocusonrecentexperimentalandtheoreticalresultsin thefieldofsuperconductingnano-electronicsdevices. Itcombinedphysicswithpresent andfuturetechnologicalapplications: bothfundamentalandappliedaspectswerecovered. SpecialemphasiswasgiventoquantumcoherenceandcomputationusingsmallJosephson junctions, noiseinultrasensitivenanodevicesandpossibilitiesofmakinguseofsupercon- ductivityinvariouson-chipdevices....
Thisvolumereportsthemajorpartofthescientificcontributionsofthefirstinternational workshoponSuperconductingNano-ElectronicsDevices(SNED)heldinNapoli, I...
|
|
cena:
382,84 zł |
Through-Silicon Vias for 3D Integration
ISBN: 9780071785143 / Angielski / Twarda / 512 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. A comprehensive guide to TSV and other enabling technologies for 3D integration
Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field... A comprehensive guide to TSV and other enabling technologies for 3D integration
Written by an expert with more than 30 years of experience in the e... |
|
cena:
978,05 zł |
Androids: Build Your Own Lifelike Robots
ISBN: 9780071814041 / Angielski / Miękka / 336 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Create the next generation of AUTONOMOUS ANDROIDS
Construct self-governing 'droids that display physiologically correct behaviors. Co-written by experts in the fields of robotics, artificial intelligence, and medicine, Androids: Build Your Own Lifelike Robots features low-cost DIY projects that translate human physiology into cybernetics. Teach your creations to maneuver with an arsenal of behaviors, respond to stimuli, talk, and listen. This practical, inventive guide even shows how to realistically simulate emotion and aging in your robots.
Create the next generation of AUTONOMOUS ANDROIDS
Construct self-governing 'droids that display physiologically correct behaviors. Co-written by e... |
|
cena:
160,45 zł |
Electromagnetic Compatibility in Power Systems
ISBN: 9780080452616 / Angielski / Twarda / 305 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. A large amount of natural or artificially produced physical phenomena are exploited for practical applications, even though several of them give rise to unpleasant consequences. These ultimately manifest themselves under form of malfunction or definitive failure of components and systems, or environmental hazard. So far, manifold categories of inadvertent or deliberate sources have been discovered to simultaneously produce useful effects in some ways but adverse ones in others. In particular, responsible for the growing interest in the last decades for Electromagnetic Compatibility (EMC) has...
A large amount of natural or artificially produced physical phenomena are exploited for practical applications, even though several of them give rise ...
|
|
cena:
778,05 zł |
Valve Amplifiers
ISBN: 9780080966403 / Angielski / Miękka / 686 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Valve Amplifiers has been recognized as the most comprehensive guide to valve amplifier design, analysis, modification and maintenance. It provides a detailed presentation of the rudiments of electronics and valve design for engineers and non-experts. The source also covers design principles and construction techniques to help end users build their own tool from scratch designs that work. The author's approach walks the reader through each step of designing and constructing, starting with an overview of the essential working principles of valve amplifiers, the simple and complex... Valve Amplifiers has been recognized as the most comprehensive guide to valve amplifier design, analysis, modification and maintenance. It p... |
|
cena:
295,61 zł |
Quantum Efficiency in Complex Systems, Part II: From Molecular Aggregates to Organic Solar Cells: Organic Solar Cells Volume 85
ISBN: 9780123910608 / Angielski / Twarda / 388 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The "Willardson and Beer" Series, as it is widely known, has succeeded in publishing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the...
Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful...
|
|
cena:
933,66 zł |
Linux for Embedded and Real-Time Applications
ISBN: 9780124159969 / Angielski / Miękka / 296 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This new edition of Linux for Embedded and Real-Time Applications provides a practical introduction to the basics and the latest developments in this rapidly evolving technology. Ideal for those new to using Linux in an embedded environment, it takes a hands-on approach and covers key concepts plus specific applications. Key features include:
This new edition of Linux for Embedded and Real-Time Applications provides a practical introduction to the basics and the latest development... |
|
cena:
181,49 zł |
Audio Power Amplifier Design
ISBN: 9780240526133 / Angielski / Miękka / 718 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This is the essential book reference for amplifier designers. Douglas Self covers all the design issues of noise, distortion, power supply rejection, protection, reliability, and layout. He describes advanced forms of compensation that give dramatically lower distortion. This edition is much expanded, and packed with new information. It is a must-have for audio power amplifier professionals and audiophiles, amateur constructors and anyone with intellectual curiosity about the struggle towards technical excellence. New to the sixth edition:
This is the essential book reference for amplifier designers. Douglas Self covers all the design issues of noise, distortion, power supply rejectio... |
|
cena:
378,60 zł |
Data Conversion Handbook
ISBN: 9780750678414 / Angielski / Twarda / 976 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This comprehensive handbook is a one-stop engineering reference. Covering data converter fundamentals, techniques, applications, and beginning with the basic theoretical elements necessary for a complete understanding of data converters, this reference covers all the latest advances in the field. This text describes in depth the theory behind and the practical design of data conversion circuits as well as describing the different architectures used in A/D and D/A converters. Details are provided on the design of high-speed ADCs, high accuracy DACs and ADCs, and sample-and-hold amplifiers....
This comprehensive handbook is a one-stop engineering reference. Covering data converter fundamentals, techniques, applications, and beginning with th...
|
|
cena:
388,97 zł |
Operational Amplifier Noise: Techniques and Tips for Analyzing and Reducing Noise
ISBN: 9780750685252 / Angielski / Twarda / 248 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Arthur Kay's exciting new publication is a must have for practicing, professional electrical engineers. This comprehensive guide shows engineers how to design amplifiers and associated electronics to minimize noise, providing tricks, rules-of-thumb, and analysis to create successful low noise circuits. Forget the classical textbook traps of equations, virtual grounds, and a lot of double-speak, the novel but educational presentation used here uses definition-by -example and straight-forward analysis. This is the ultimate reference book for engineers who don't have the time to read, since... Arthur Kay's exciting new publication is a must have for practicing, professional electrical engineers. This comprehensive guide shows engineers ho... |
|
cena:
264,48 zł |