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Kategoria BISAC: Technology & Engineering >> Electronics - Circuits - General
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Interconnect Reliability in Advanced Memory Device Packaging
ISBN: 9783031267079 / Angielski Termin realizacji zamówienia: ok. 5-8 dni roboczych. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and...
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 ...
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cena:
805,10 |
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Interconnect Reliability in Advanced Memory Device Packaging
ISBN: 9783031267109 / Angielski / Miękka Termin realizacji zamówienia: ok. 5-8 dni roboczych. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and... This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.
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cena:
805,10 |
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Advances in Data-Driven Computing and Intelligent Systems: Selected Papers from Adcis 2023, Volume 3
ISBN: 9789819995172 / Angielski Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
805,10 |
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Advances in Data-Driven Computing and Intelligent Systems: Selected Papers from Adcis 2023, Volume 2
ISBN: 9789819995202 / Angielski Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
805,10 |
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Advances in Data-Driven Computing and Intelligent Systems: Selected Papers from Adcis 2023, Volume 1
ISBN: 9789819995233 / Angielski Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
805,10 |
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Cyber Security for Smart Grid Control: Vulnerability Assessment, Attack Detection and Mitigation
ISBN: 9789819713011 / Angielski Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
805,10 |
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Proceedings of Third International Conference on Computational Electronics for Wireless Communications: Iccwc 2023, Volume 1
ISBN: 9789819719426 / Angielski Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
805,10 |
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Proceedings of Third International Conference on Computational Electronics for Wireless Communications: Iccwc 2023, Volume 2
ISBN: 9789819719457 / Angielski Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
805,10 |
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VLSI for Embedded Intelligence: Proceedings of the 27th International Symposium, Vdat 2023
ISBN: 9789819737550 / Angielski Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
805,10 |
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Writing Testbenches Using Systemverilog
ISBN: 9780387292212 / Angielski / Twarda / 440 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Verification is too often approached in an ad hoc fashion. Visually inspecting simulation results is no longer feasible and the directed test-case methodology is reaching its limit. Moore's Law demands a productivity revolution in functional verification methodology. Writing Testbenches Using SystemVerilog offers a clear blueprint of a verification process that aims for first-time success using the SystemVerilog language. From simulators to source management tools, from specification to functional coverage, from I's and O's to high-level abstractions, from... Verification is too often approached in an ad hoc fashion. Visually inspecting simulation results is no longer feasible and the directed test-case ... |
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805,10 |
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Solder Joint Reliability: Theory and Applications
ISBN: 9780442002602 / Angielski / Twarda / 631 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo...
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic co...
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805,10 |
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High Voltage Devices and Circuits in Standard CMOS Technologies
ISBN: 9780792382348 / Angielski / Twarda / 288 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Standard voltages used in today's ICs may vary from about 1.3V to more than 100V, depending on the technology and the application. High voltage is therefore a relative notion.
High Voltage Devices and Circuits in Standard CMOS Technologies is mainly focused on standard CMOS technologies, where high voltage (HV) is defined as any voltage higher than the nominal (low) voltage, i.e. 5V, 3.3V, or even lower. In this standard CMOS environment, IC designers are more and more frequently confronted with HV problems, particularly at the I/O level of the circuit. In the first group... Standard voltages used in today's ICs may vary from about 1.3V to more than 100V, depending on the technology and the application. High voltage is the...
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805,10 |
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Hot-Carrier Reliability of Mos VLSI Circuits
ISBN: 9780792393528 / Angielski / Twarda / 212 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. As the complexity and the density of VLSI chips increase with shrinking design rules, the evaluation of long-term reliability of MOS VLSI circuits is becoming an important problem. The assessment and improvement of reliability on the circuit level should be based on both the failure mode analysis and the basic understanding of the physical failure mechanisms observed in integrated circuits. Hot-carrier induced degrada- tion of MOS transistor characteristics is one of the primary mechanisms affecting the long-term reliability of MOS VLSI circuits. It is likely to become even more important in...
As the complexity and the density of VLSI chips increase with shrinking design rules, the evaluation of long-term reliability of MOS VLSI circuits is ...
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805,10 |
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Computation in Neurons and Neural Systems
ISBN: 9780792394655 / Angielski / Twarda / 319 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Computation in Neurons and Neural Systems contains the collected papers of the 1993 Conference on Computation and Neural Systems which was held between July 31--August 7, in Washington, DC. These papers represent a cross-section of the state-of-the-art research work in the field of computational neuroscience, and includes coverage of analysis and modeling work as well as results of new biological experimentation.
Computation in Neurons and Neural Systems contains the collected papers of the 1993 Conference on Computation and Neural Systems which was he...
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Digit-Serial Computation
ISBN: 9780792395737 / Angielski / Twarda / 306 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Digital signal processing (DSP) is used in a wide range of applications such as speech, telephone, mobile radio, video, radar and sonar. The sample rate requirements of these applications range from 10 KHz to 100 MHz. Real time implementation of these systems requires design of hardware which can process signal samples as these are received from the source, as opposed to storing them in buffers and processing them in batch mode. Efficient implementation of real time hardware for DSP applications requires study of families of architectures and implementation styles out of which an appropriate...
Digital signal processing (DSP) is used in a wide range of applications such as speech, telephone, mobile radio, video, radar and sonar. The sample ra...
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cena:
805,10 |
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Hardware/Software Co-Design and Co-Verification
ISBN: 9780792396895 / Angielski / Twarda / 166 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Co-Design is the set of emerging techniques which allows for the simultaneous design of Hardware and Software. In many cases where the application is very demanding in terms of various performances (time, surface, power consumption), trade-offs between dedicated hardware and dedicated software are becoming increasingly difficult to decide upon in the early stages of a design. Verification techniques - such as simulation or proof techniques - that have proven necessary in the hardware design must be dramatically adapted to the simultaneous verification of Software and Hardware.
... Co-Design is the set of emerging techniques which allows for the simultaneous design of Hardware and Software. In many cases where the application is ...
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Timing
ISBN: 9781402076718 / Angielski / Twarda / 294 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Statistical timing analysis is an area of growing importance in nanometer te- nologies' as the uncertainties associated with process and environmental var- tions increase' and this chapter has captured some of the major efforts in this area. This remains a very active field of research' and there is likely to be a great deal of new research to be found in conferences and journals after this book is published. In addition to the statistical analysis of combinational circuits' a good deal of work has been carried out in analyzing the effect of variations on clock skew. Although we will not...
Statistical timing analysis is an area of growing importance in nanometer te- nologies' as the uncertainties associated with process and environmental...
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805,10 |
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Complex Computing-Networks: Brain-Like and Wave-Oriented Electrodynamic Algorithms
ISBN: 9783540306351 / Angielski / Twarda / 398 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This book contains the ceremonials and the proceedings pertaining to the Int- national Symposium CCN2005 on Complex Computing-Networks: A Link between Brain-like and Wave-Oriented Electrodynamics Algorithms, convened at Do ?u ? University of Istanbul, Turkey, on 13 14 June 2005, in connection with the bestowal of the honorary doctorate degrees on Professors Leopold B. Felsen and Leon O. Chua, for their extraordinary achievements in electromagnetics, and n- linear systems, respectively. The symposium was co-organized by Cem Goknar and Levent Sevgi, in consultation with Leopold B. Felsen and...
This book contains the ceremonials and the proceedings pertaining to the Int- national Symposium CCN2005 on Complex Computing-Networks: A Link between...
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cena:
805,10 |
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Models in System Design
ISBN: 9780792398745 / Angielski / Twarda / 152 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Models in System Design tracks the general trend in electronics in terms of size, complexity and difficulty of maintenance. System design is by nature combined with prototyping, mixed domain design, and verification, and it is no surprise that today's modeling and models are used in various levels of system design and verification. In order to deal with constraints induced by volume and complexity, new methods and techniques have been defined. Models in System Design provides an overview of the latest modeling techniques for use by system designers.
The first part of... Models in System Design tracks the general trend in electronics in terms of size, complexity and difficulty of maintenance. System design is ...
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cena:
805,10 |
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Nanolithography: A Borderland Between Stm, Eb, Ib, and X-Ray Lithographies
ISBN: 9780792327943 / Angielski / Twarda / 216 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Success in the fabrication of structures at the nanometer length scale has opened up a new horizon to condensed matter physics: the study of quantum phenomena in confined boxes, wires, rings, etc. A new class of electronic devices based on this physics has been proposed, with the promise of a new functionality for ultrafast and/or ultradense electronic circuits. Such applications demand highly sophisticated fabrication techniques, the crucial one being lithography.
Nanolithography contains updated reviews by major experts on the well established techniques -- electron beam... Success in the fabrication of structures at the nanometer length scale has opened up a new horizon to condensed matter physics: the study of quantum p...
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cena:
805,10 |
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