Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo...
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic co...
Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. For professionals active in TAB research and development, those who wish to master TAB problem solving methods, and those who must choose a high-performance and cost-effective packaging technique for their interconnect systems, here's a timely summary of progress in all aspects of this fascinating field.
Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding,...
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and...
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who w...
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to b...
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me- chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica- tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo-...
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic co...