Kategoria BISAC: Technology & Engineering >> Optics

A variety of nanomaterials have excellent optoelectronic and electronic properties for novel device applications. At the same time, and with advances in silicon integrated circuit (IC) techniques, compatible Si-based nanomaterials hold promise of applying the advantages of nanomaterials to the conventional IC industry. This book focuses not only on silicon nanomaterials, but also summarizes up-to-date developments in the integration of non-silicon nanomaterials on silicon. The book showcases the work of leading researchers from around the world who address such key questions as: Which...

In the last decade, optically functionalized materials have developed rapidly, from bulk matters to structured forms. Now we have a rich variety of attractive advanced materials. They are applied to optical and electrical devices that support the information communication technology in the mid 21-th century. Accordingly, it is quite important to have a broad knowledge of the optical properties of advanced materials for students, scientists and engineers working in optics and related fields. This book is designed to teach fundamental optical properties of such advanced materials...

This book describes recent innovations in 3D media and technologies, with coverage of 3D media capturing, processing, encoding, and adaptation, networking aspects for 3D Media, and quality of user experience (QoE). The main contributions are based on the results of the FP7 European Projects ROMEO, which focus on new methods for the compression and delivery of 3D multi-view video and spatial audio, as well as the optimization of networking and compression jointly across the Future Internet (www.ict-romeo.eu).

The delivery of 3D media to individual users remains a highly...

Optical Fiber Telecommunications VI (A&B) is the sixth in a series that has chronicled the progress in the R&D of lightwave communications since the early 1970s. Written by active authorities from academia and industry, this edition brings a fresh look to many essential topics, including devices, subsystems, systems and networks. A central theme is the enabling of high-bandwidth communications in a cost-effective manner for the development of customer applications. These volumes are an ideal reference for R&D engineers and managers, optical systems implementers, university...

For decades, the surface-plasmon-polariton wave guided by the interface of simple isotropic materials dominated the scene. However, in recent times research on electromagnetic surface waves guided by planar interfaces has expanded into new and exciting areas. In the 1990's research focused on advancing knowledge of the newly discovered Dyakonov wave. More recently, much of the surface wave research is motivated by the proliferation of nanotechnology and the growing number of materials available with novel properties. This book leads the reader from the relatively simple...

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.