Kategoria BISAC: Technology & Engineering >> Metallurgy

Multifunctional Metallic Hollow Sphere Structures are an emerging new material category, belonging like metal foams to the class cellular metals. Thanks to their advantageous mechanical and sound absorbing properties, Multifunctional Metallic Hollow Sphere Structures are very promising for various applications and our technological knowledge makes them ready for industrial usage.

This reference gives a complete overview on this new materials class, the fundamentals, the applications and the perspective for future use. It provides the foundations for a profound understanding...

Bulk metallic glasses are a new emerging field of materials with many desirable and unique properties, such as high strength, good hardness, good wear resistance, and high corrosion resistance that can be produced in near net shape components. These amorphous materials have many diverse applications from structural applications to biomedical implants.

A complete overview of bulk metallic glasses is presented: the principles of alloy design, glass formation, processing, atomistic modeling, computer simulations, mechanical properties and microstructures.

Magnesium, with a density of 1.74 g/cm, is the lightest structural metal and magnesium are increasingly chosen for weight-critical applications such as in land-based transport systems. "Magnesium Technology" substantially updates and complements existing reference sources on this key material. It assembles international contributions from seven countries covering a wide range of research programs into new alloys with the requisite property profiles, i.e., the current state of both research and technological applications of magnesium. In particular, the international team of authors covers...

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1^st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint...