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Handbook of Electronic Package Design
ISBN: 9780824779214 / Angielski / Twarda / 904 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Presents a treatment that begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development. It is both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques.
Presents a treatment that begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the...
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cena:
2064,57 |
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The Theory of Piezoelectric Shells and Plates
ISBN: 9780849344596 / Angielski / Twarda / 272 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Presents a systematic description of the linear theory of piezoelectric shells and plates theory. This book covers the theories for electroelastic thin-walled elements of arbitrary form with different directions of preliminary polarization. It is suitable for researchers working in the field of electroelasticity.
Presents a systematic description of the linear theory of piezoelectric shells and plates theory. This book covers the theories for electroelastic thi...
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cena:
2064,57 |
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Power Transmissions: Proceedings of the International Conference on Power Transmissions 2016 (Icpt 2016), Chongqing, P.R. China, 27-30 Octo
ISBN: 9781138032675 / Angielski / Twarda / 1064 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This book presents papers from the International Conference on Power Transmissions 2016, held in Chongqing, P.R. China, 27th-30th October 2016. The main objective of this conference is to provide a forum for the most recent advances, addressing the challenges in modern mechanical transmissions. The conference proceedings address all aspects of gear and power transmission technology and a range of applications. The presented papers are catalogued into three main tracks, including design, simulation and testing, materials and manufacturing, and industrial applications. The design,... This book presents papers from the International Conference on Power Transmissions 2016, held in Chongqing, P.R. China, 27th-30th October 2016. The... |
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2064,57 |
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Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 1: Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Em
ISBN: 9789814327633 / Angielski / Twarda Termin realizacji zamówienia: ok. 5-8 dni roboczych. This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical...
This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applica...
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cena:
2088,87 |
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Emerging Trends in Mobile Robotics - Proceedings of the 13th International Conference on Climbing and Walking Robots and the Support Technologies for
ISBN: 9789814327978 / Angielski / Twarda / 1388 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Provides scientific and engineering research findings and developments in the area of mobile robotics and associated support technologies. This book contains articles presented at the CLAWAR 2010 conference.
Provides scientific and engineering research findings and developments in the area of mobile robotics and associated support technologies. This book c...
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cena:
2137,44 |
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Microelectronic Materials and Processes
ISBN: 9780792301547 / Angielski / Miękka / 1000 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. The primary thrust of very large scale integration (VLS ) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon...
The primary thrust of very large scale integration (VLS ) is the miniaturization of devices to increase packing density, achieve higher speed, and con...
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cena:
2214,09 |
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Microelectronic Materials and Processes
ISBN: 9780792301479 / Angielski / Twarda / 1000 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. The primary thrust of very large scale integration (VLS ) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon...
The primary thrust of very large scale integration (VLS ) is the miniaturization of devices to increase packing density, achieve higher speed, and con...
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cena:
2214,09 |
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Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 3: Compact Thermal Models of Electronic Components
ISBN: 9789814313841 / Angielski / Twarda Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
2234,60 |
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Handbook of Measurement in Science and Engineering
ISBN: 9781118450772 / Angielski / Other digital carrier / 2096 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
2251,99 |
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Springer Handbook of Speech Processing
ISBN: 9783662533000 / Angielski / Twarda / 1176 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. From common consumer products such as cell phones and MP3 players to more sophisticated projects such as human-machine interfaces and responsive robots, speech technologies are now everywhere. Many think that it is just a matter of time before more applications of the science of speech become inescapable in our daily life. This handbook is meant to play a fundamental role for sustainable progress in speech research and development. Springer Handbook of Speech Processing targets three categories of readers: graduate students, professors and active researchers in academia and...
From common consumer products such as cell phones and MP3 players to more sophisticated projects such as human-machine interfaces and responsive robot...
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cena:
2411,40 |
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The Industrial Electronics Handbook - Five Volume Set
ISBN: 9781439802892 / Angielski / Twarda / 4052 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Industrial electronics systems govern so many different functions that vary in complexity from the operation of relatively simple applications, such as electric motors, to that of more complicated machines and systems, including robots and entire fabrication processes. The Industrial Electronics Handbook, Second Edition combines traditional and newer, more specialized knowledge that will help industrial electronics engineers develop practical solutions for the design and implementation of modern industrial systems. Embracing the broad technological scope of the... Industrial electronics systems govern so many different functions that vary in complexity from the operation of relatively simple applications, suc... |
cena:
2428,91 |
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Compound Semiconductors 2001
ISBN: 9780750308564 / Angielski / Twarda / 855 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. An international perspective on recent research, Compound Semiconductors 2001 provides an overview of important developments in III-V compound semiconductors, such as GaAs, InP, and GaN; II-VI compounds, such as ZnSe and CdTe; and IV-IV compounds, such as SiC and SiGe. The book contains 139 papers arranged in chapters on electronic devices, optical devices, magnetic materials, novel systems, quantum transport, optical characterization, quantum nanostructures, and material growth and characterization. The content encompasses the development of optical and electronic devices based on nitride...
An international perspective on recent research, Compound Semiconductors 2001 provides an overview of important developments in III-V compound semicon...
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cena:
2428,91 |
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CRC Handbook of Thermoelectrics
ISBN: 9780849301469 / Angielski / Twarda / 720 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Covers activities in thermoelectrics. The book is arranged into sections on principles; preparation; measurement of thermoelectric properties; thermoelectric materials; thermoelectric generation; generator applications; thermoelectric refrigeration; and applications of thermoelectric cooling.
Covers activities in thermoelectrics. The book is arranged into sections on principles; preparation; measurement of thermoelectric properties; thermoe...
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cena:
2428,91 |
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Micro Electro Mechanical Systems
ISBN: 9789811059445 / Angielski / Twarda / 1479 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
2817,95 |
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Computer Vision: A Reference Guide
ISBN: 9783030634155 / Angielski / Twarda / 1450 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
3019,23 |
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Computer Vision: A Reference Guide
ISBN: 9780387307718 / Angielski / Twarda / 898 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This comprehensive reference provides easy access to relevant information on all aspects of Computer Vision. An A-Z format of over 240 entries offers a diverse range of topics for those seeking entry into any aspect within the broad field of Computer Vision. Over 200 Authors from both industry and academia contributed to this volume.
Each entry includes synonyms, a definition and discussion of the topic, and a robust bibliography. Extensive cross-references to other entries support efficient, user-friendly searches for immediate access to relevant information. Entries were... This comprehensive reference provides easy access to relevant information on all aspects of Computer Vision. An A-Z format of over 240 entries offe... |
cena:
3220,52 |
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Handbook of Measurement Science, Volume 1: Theoretical Fundamentals
ISBN: 9780471100379 / Angielski / Twarda / 678 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. A handbook stressing the enduring theoretical principles of the design of measurement systems. The material is organized to correspond to the sequence in which a management system is first conceived, then designed, built, installed, and maintained. Includes the latest information on digital signals, pattern recognition, digital data networks and feedback systems design, and focus on the problem of extracting signals in the presence of noise sources at any useful depth.
A handbook stressing the enduring theoretical principles of the design of measurement systems. The material is organized to correspond to the sequence...
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cena:
4668,37 |
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Encyclopedia of Thermal Packaging, Set 3: Thermal Packaging Applications (a 3-Volume Set)
ISBN: 9789813239661 / Angielski / Twarda / 904 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
5367,89 |
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Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set)
ISBN: 9789814313780 / Angielski / Twarda / 1580 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density. This title provides comprehensive treatment of the techniques, configurations, tools and applications of electronic thermal packaging.
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and fu...
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cena:
6368,61 |
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Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools (a 4-Volume Set)
ISBN: 9789814327602 / Angielski / Open Ebook / 1396 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products. This book provides a treatment of its techniques, configurations, tools and applications.
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and fu...
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cena:
6368,61 |
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