Kategoria BISAC: Computers >> Artificial Intelligence - Expert Systems

This book constitutes the thoroughly refereed post-conference proceedings of the 4th International ICST Conference on Sensor Systems and Software, S-Cube 2013, held in Lucca, Italy, 2013. The 8 revised full papers and 2 invited papers presented cover contributions on different technologies for wireless sensor networks, including security protocols, middleware, analysis tools and frameworks.

This book constitutes the refereed proceedings of the 11th European Conference on Wireless Sensor Networks, EWSN 2014, held in Oxford, UK, in February 2014.
The 12 revised full papers presented were carefully reviewed and selected from 50 submissions. The papers cover a wide range of topics in the following areas: network protocols, system issues, reliability and sensing.

Addressing current issues of which any engineer or computer scientist should be aware, this monograph is a response to the need to adopt a new computational paradigm as the methodological basis for designing pervasive embedded systems with sensor capabilities. The requirements of this paradigm are to control complexity, to limit cost and energy consumption and to provide adaptation and cognition abilities allowing the embedded system to interact proactively with the real world. The quest for such intelligence requires the formalization of a new generation of intelligent systems able to...

The book is inspired by the third seminar in a cycle connected to the celebrations of the 150th anniversary of the Politecnico di Milano (July 2013). "Educating by Image. Teaching Styles vs Learning Styles" was the motto of this meeting. The contributions (coming from lectures, the poster session, interviews and round table) aim to propose an updated look at visual education, highlighting how digital tools and networks have profoundly affected the "representational styles" of the teachers and the "cognitive styles" of the learners, while at the same time reaffirming the importance of the...

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep intoTSV for many years and the accumulated technical...