Since the advent of planar technology the literature on semi- conductor devices has been growing exponentially. This book of over 14000 references is intended to make the world literature available to workers in the field (beginners as well as experienced) to assist them in finding out what has been done by others in their fields of endeavor. The literature on theory, preparation, properties, character- ization, packaging, instrumentation and applications of semiconductor devices is thoroughly covered; the only aspect of preparation not covered is di ffusion. However, several books and...
Since the advent of planar technology the literature on semi- conductor devices has been growing exponentially. This book of over 14000 references is ...
During the past decade, dramatic advances have been made in computer technology. These advances are primarily as a result of the tremendous progress in semiconductor technology, paced by planar processing and LSI. Great strides have also been made in mass storage media, such as: magnetic recording, bubble domains, charge-coupled devices, beam-addressed storage, and optical storage. The mini- and microcomputer revolution has led to a major broadening of the computer industry's horizons and applications. Many writers have speculated on further progress in the coming years; other have discussed...
During the past decade, dramatic advances have been made in computer technology. These advances are primarily as a result of the tremendous progress i...
Microelectronic packaging protects and supports electronic devices and circuits and provides connections to the other parts of the system. The protection function avoids mechanical, electrical, chemical, contamination, and photo-optical damage, degeneration, and causes of malfunction. Hybrid microelectronic circuits and subsystem packages support the substrates; the substrate contains the circuit elements, (semiconductor devices or IC chips, deposited or chip resistors and capacitors, and attached inductors), as well as deposited and bonded interconnection wires. The connections to other...
Microelectronic packaging protects and supports electronic devices and circuits and provides connections to the other parts of the system. The protect...
The metal-oxide-semiconductor field-effect transistor (MOSFET) was invented in 1960. The processing technology required for suc- cessful high volume fabrication became available in 1968. The use of doped polycrystalline silicon as the gate electrode, instead of aluminum or some other metal, resulted in substantial enhancement in performance. Efforts to improve the properties of MOS devices produced new structures such as: CMOS, MNOS, SOS, VMOS, DMOS, FAMOS, etc. In recent years a great deal of work has been done to study the fabrication and properties of MOSFET's. There are two reasons for...
The metal-oxide-semiconductor field-effect transistor (MOSFET) was invented in 1960. The processing technology required for suc- cessful high volume f...
