Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, TAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching. Such structures cannot be used directly, they must be designed and fabricated as a part of the three - dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book contains the...
Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, TAS (analytical...
This is the first book to comprehensively record the authors' authoritative knowledge and practical experience of IC manufacturing, including the tremendous developments of recent years. With its strong application orientation, this is a must-have book for professionals in semiconductor industries.
This is the first book to comprehensively record the authors' authoritative knowledge and practical experience of IC manufacturing, including the t...
System-on-a-chip (SoC) designs result in a wide range of high-complexity, high-value semiconductor products. As the technology scales towards smaller feature sizes and chips grow larger, a speed limitation arises due to an in- creased RC delay associated with interconnection wires. Innovative circuit techniques are required to achieve the speed needed for high-performance signal processing. Current sensing is considered as a promising circuit class since it is inherently faster than conventional voltage sense amplifiers. How- ever, especially in SRAM, current sensing has rarely been used so...
System-on-a-chip (SoC) designs result in a wide range of high-complexity, high-value semiconductor products. As the technology scales towards smaller ...
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility...
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the ele...
New manufacturing technologies have made possible the integration of entire systems on a single chip. This new design paradigm, termed system-on-chip (SOC), together with its associated manufacturing problems, represents a real challenge for designers.
SOC is also reshaping approaches to test and validation activities. These are beginning to migrate from the traditional register-transfer or gate levels of abstraction to the system level. Until now, test and validation have not been supported by system-level design tools so designers have lacked the infrastructure to exploit all the...
New manufacturing technologies have made possible the integration of entire systems on a single chip. This new design paradigm, termed system-on-ch...
This work investigates the feasibility of the integration of interface circuits for op- tical communication systems in a standard unmodified digital CMOS process. This paves the way for single chip communication systems where the optical interfaces are integrated on the same die as the required digital circuitry. The optical receiver is a key element in the optical communication link. In this work, a transimpedance amplifier, which consists of a voltage amplifier with resis- tive feedback, is used as the first stage. Unlike for many other circuits, the optimal place of its dominant pole is...
This work investigates the feasibility of the integration of interface circuits for op- tical communication systems in a standard unmodified digital C...
Due to the ever increasing electric fields in scaled CMOS devices, reliability is becoming a showstopper for further scaled technology nodes. Although several groups have already demonstrated functional Si channel devices with aggressively scaled Equivalent Oxide Thickness (EOT) down to 5A, a 10 year reliable device operation cannot be guaranteed anymore due to severe Negative Bias Temperature Instability.
This book focuses on the reliability of the novel (Si)Ge channel quantum well pMOSFET technology. This technology is being considered for possible implementation in next CMOS...
Due to the ever increasing electric fields in scaled CMOS devices, reliability is becoming a showstopper for further scaled technology nodes. Altho...
This is the first comprehensive book on ferroelectric memories which contains chapters on device design, processing, testing, and device physics, as well as on breakdown, leakage currents, switching mechanisms, and fatigue. State-of-the-art device designs are included and illustrated among the books many figures. More than 500 up-to-date references and 76 problems make it useful as a research reference for physicists, engineers and students.
This is the first comprehensive book on ferroelectric memories which contains chapters on device design, processing, testing, and device physics, as w...
In the deep sub-micron regime, the power consumption has become one of the most important issues for competitive design of digital circuits. Due to dramatically increasing leakage currents, the power consumption does not take advantage of technology scaling as before. State-of-art power reduction techniques like the use of multiple supply and threshold voltages, transistor stack forcing and power gating are discussed with respect to implementation and power saving capability. Focus is given especially on technology dependencies, process variations and technology scaling. Design and...
In the deep sub-micron regime, the power consumption has become one of the most important issues for competitive design of digital circuits. Due to...
Highly Sensitive Optical Receivers primarily treats the circuit design of optical receivers with external photodiodes. Continuous-mode and burst-mode receivers are compared. The monograph first summarizes the basics of III/V photodetectors, transistor and noise models, bit-error rate, sensitivity and analog circuit design, thus enabling readers to understand the circuits described in the main part of the book. In order to cover the topic comprehensively, detailed descriptions of receivers for optical data communication in general and, in particular, optical burst-mode...
Highly Sensitive Optical Receivers primarily treats the circuit design of optical receivers with external photodiodes. Continuous-...
