wyszukanych pozycji: 2
The Super-Evolution of Semiconductors
ISBN: 9783031605178 / Angielski Termin realizacji zamówienia: ok. 20 dni roboczych. |
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cena:
195,87 zł |
Wireless Interface Technologies for 3D IC and Module Integration
ISBN: 9781108841214 / Angielski / Twarda / 2021 / 300 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making...
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and mod...
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cena:
627,64 zł |