Wireless Interface Technologies for 3D IC and Module Integration

ISBN-13: 9781108841214 / Angielski / Twarda / 2021 / 300 str.

Tadahiro Kuroda (University of Tokyo);Wai-Yeung Yip (University of Tokyo)

Opis

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

Spis treści

1. Introduction – 3D integration and near-field coupling; 2. ThruChip interface – a wireless chip interface; 3. Transmission line coupler – a wireless module connector; 4. The future of computing – 3D SRAM for neural network, eBrain.