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wyszukanych pozycji: 6
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Thin Film Morphology Control by Electronic and Chemical Interactions
ISBN: 9783659195013 / Angielski / Miękka / 2012 / 76 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. Studies of thin film growth involve interdependent chemical, electronic and mechanical properties whose comprehensive understanding is critical for predicting thin film morphology and properties. Self assembly of organic molecules on a metal substrate lays the groundwork for structures desired in nanotechnology applications. The three classes of films which I investigate are: monolayer MoS2 with strong Mo-S bonding, anthracene films formed by weak van der Waals interactions, and anthraquinine (AQ) honeycomb networks assembled by the interplay of local hydrogen bonding and substrate-mediated...
Studies of thin film growth involve interdependent chemical, electronic and mechanical properties whose comprehensive understanding is critical for pr...
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cena:
220,21 |
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Microstructure Evolution of Carbides in Nuclear Radiation Conditions
ISBN: 9786200456359 / Angielski / Miękka / 2019 / 116 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. |
cena:
197,28 |
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The Time Related High Temperature Constitutive Theory for Cr Steels
ISBN: 9783659625114 / Angielski / Miękka / 2017 / 208 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. |
cena:
233,24 |
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Design of framework for coding the damage evaluation FE application
ISBN: 9786139946273 / Angielski / Miękka / 2018 / 228 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. |
cena:
278,18 |
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Multimodal Approaches to Chinese-English Translation and Interpreting
ISBN: 9780367331962 / Angielski / Twarda / 2020 / 224 str. Termin realizacji zamówienia: ok. 16-18 dni roboczych. |
cena:
760,69 |
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Programming the Finite Element Software for Creep Damage Analysis
ISBN: 9783659796906 / Angielski / Miękka / 2015 / 332 str. Termin realizacji zamówienia: ok. 10-14 dni roboczych. Creep deformation and failure in high temperature structures is a serious problem for industry and is becoming even more so under the current increasing pressures of power, economics and sustainability. This book presents the development of in-house FE software for creep damage analysis. A novel in-house FE software was developed through the use of Continuum Damage Mechanics (CDM) and finite element method (FEM) in conjunction with an advanced engineering computer programming language (Fortran 2003) based on an objected oriented programming (OOP) approach.
Creep deformation and failure in high temperature structures is a serious problem for industry and is becoming even more so under the current increasi...
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cena:
395,02 |
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