wyszukanych pozycji: 2
Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)
ISBN: 9789811201110 / Angielski / Twarda / 2019 / 1080 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
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cena:
6468,99 zł |
Mechanical Design of Electronic Systems
ISBN: 9780976241331 / Angielski / Miękka / 2017 / 658 str. Termin realizacji zamówienia: ok. 13-18 dni roboczych. This book has been written for engineers to serve as a first text on the packaging of electronic systems. The material has been written for an engineering student or for a practicing professional working as a mechanical or electrical engineer with a company producing electronic products or systems. The engineering student should have completed fundamental courses in the engineering sciences, thermal sciences and materials as prerequisites. The practicing professional will probably be at the early stages of his or her career and be more concerned with the technical details of the design... This book has been written for engineers to serve as a first text on the packaging of electronic systems. The material has been written for an engi... |
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cena:
627,42 zł |