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2nd Edition. The almost exponential increase in density, complexity, and performance of integrated circuits over the past ten years (for example, ASIC (Application Specific Integrated Circuit), VHSIC (Very High Speed IC), VLSIC (Very Large Scale IC), and ULSIC (Ultra Large Scale IC) have driven developments in the interconnect substrates culminating in what is now known as multichip modules (MCM). However, the fundamental of design, fabrication, and testing of MCM's are essentially the same as hybrid microcircuits. In the authors' opinion MCM's are extensions of hybrid circuits that can...

This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics.

This first book in the Materials and Processes for Electronics Applications series answers questions vital to the successful design and manufacturing of electronic components, modules, and systems such as:
- How can one protect electronic assemblies from prolonged high humidity, high temperatures, salt spray or other terrestrial and space environments?
- What coating types can be used to protect microelectronics in military, space, automotive, or medical environments?
- How can the chemistry of polymers be correlated to desirable physical and electrical properties?
- How can...

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.

The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this...