Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production

ISBN-13: 9780815514237 / Angielski / Twarda / 1998 / 600 str.

James J. Licari; Leonard R. Enlow

Opis

2nd Edition. The almost exponential increase in density, complexity, and performance of integrated circuits over the past ten years (for example, ASIC (Application Specific Integrated Circuit), VHSIC (Very High Speed IC), VLSIC (Very Large Scale IC), and ULSIC (Ultra Large Scale IC) have driven developments in the interconnect substrates culminating in what is now known as multichip modules (MCM). However, the fundamental of design, fabrication, and testing of MCM's are essentially the same as hybrid microcircuits. In the authors' opinion MCM's are extensions of hybrid circuits that can accommodate the new generation of high-speed high performance chips. This revised edition expands the treatment of hybrid circuits without finding it necessary to change the fundamentals. The authors have included a separate chapter on multi-chip modules and throughout the book have included new and emerging materials and processes that are beginning to be used. Examples include: Metal-matrix composites and aluminum nitride ad substrate materials. to hermetic sealed packages, atmospheric friendly cleaning solvents and methods, and advanced high I/O density quad flat packages (QFP) and ball grid array (BCA) packages. Advances in software programs for thermal and electrical analysis and these are covered in this new edition. Contents Include: Introduction: Substrates: Thin Film Processes Deposition Processes Thin Film Resistor Processes Photoresist Material and Processes Etching Material and Processes. Thick Film Processes: Fabrication Processes Direct Writing Paste Materials Non-Noble-Metal Thick Films Polymer Thick Film. Reactor Trimming: Parts Selection Assembly Processes Die and Substrate Attachment Interconnections Cleaning Particle Immobilizing Coating Vacuum-Baking and Sealing. Testing. Handling and Clean Rooms: Handling of Hybrid Circuits Electrostatic Discharge. Design Guidelines. Documentation and Specification. Failure Analysis. Multichip Module.

Spis treści

IntroductionSubstratesThin Film ProcessesThick Film ProcessesResistor TrimmingParts SelectionAssembly ProcessesTestingHandling and Clean RoomsDesign GuidelinesDocumentation and SpecificationsFailure AnalysisMultichip Modules: A New Breed of Hybrid MicrocircuitsReferencesIndex

O autorze

has his own consulting firm, AvanTeco, specializing in materials and processes for electronics. He holds a BS in Chemistry from Fordham University and a PhD in Chemistry from Princeton University, where he was a DuPont Senior Fellow. His areas of expertise include materials and processes for electronic applications, primarily for high reliability systems, hybrid microcircuits, printed wiring circuits, and other interconnect packaging technologies. He is an expert on polymeric materials including adhesives, coatings, encapsulants, insulation, reliability based on failure modes and mechanisms. Dr. Licari has had a forty-year career dedicated to the study and advancement of microelectronic materials and processes.

Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont's Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157) . The work was referenced as pioneering work in a review article by J.V. Crivello "The Discovery ad Development of Onium Salt Cationic Photoinitiators,” J. Polymer Chemistry (1999)