2nd Edition. The almost exponential increase in density, complexity, and performance of integrated circuits over the past ten years (for example, ASIC (Application Specific Integrated Circuit), VHSIC (Very High Speed IC), VLSIC (Very Large Scale IC), and ULSIC (Ultra Large Scale IC) have driven developments in the interconnect substrates culminating in what is now known as multichip modules (MCM). However, the fundamental of design, fabrication, and testing of MCM's are essentially the same as hybrid microcircuits. In the authors' opinion MCM's are extensions of hybrid circuits that can...
2nd Edition. The almost exponential increase in density, complexity, and performance of integrated circuits over the past ten years (for example, ASIC...
