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wyszukanych pozycji: 12
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Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 2: Energy Optimization and Thermal Management of Data Centers
ISBN: 9789814327657 / Angielski / Twarda / 2014 Termin realizacji zamówienia: ok. 22 dni roboczych. This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical...
This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applica...
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cena:
1685,78 zł |
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Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools (a 4-Volume Set)
ISBN: 9789814327602 / Angielski / Open Ebook / 2014 / 1396 str. Termin realizacji zamówienia: ok. 22 dni roboczych. Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products. This book provides a treatment of its techniques, configurations, tools and applications.
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and fu...
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cena:
6800,16 zł |
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Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set)
ISBN: 9789814313780 / Angielski / Twarda / 2012 / 1580 str. Termin realizacji zamówienia: ok. 22 dni roboczych. Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density. This title provides comprehensive treatment of the techniques, configurations, tools and applications of electronic thermal packaging.
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and fu...
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cena:
6800,16 zł |
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Encyclopedia of Thermal Packaging, Set 3: Thermal Packaging Applications (a 3-Volume Set)
ISBN: 9789813239661 / Angielski / Twarda / 2018 / 904 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
cena:
5731,64 zł |
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Advances in Heat Transfer: Volume 41
ISBN: 9780123814241 / Angielski / Twarda / 2009 / 209 str. Termin realizacji zamówienia: ok. 13-18 dni roboczych. Advances in Heat Transfer fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in journals or texts. The articles, which serve as a broad review for experts in the field, will also be of great interest to non-specialists who need to keep up-to-date with the results of the latest research. This serial is essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, graduate schools or industry.
Advances in Heat Transfer fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth r...
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cena:
1402,65 zł |
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Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 6: Experimental Thermofluid Characterization of Electronic Components
ISBN: 9789814327626 / Angielski / Twarda / 2013 / 308 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
cena:
1291,56 zł |
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Design and Analysis of Heat Sinks
ISBN: 9780471017554 / Angielski / Twarda / 1995 / 424 str. Termin realizacji zamówienia: ok. 22 dni roboczych. A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . .
Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal... A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . .
Here is the only available co... |
cena:
862,41 zł |
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Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 2: Air- And Liquid-Cooled Cold Plates
ISBN: 9789814313810 / Angielski / Twarda / 2013 / 208 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
cena:
1203,38 zł |
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Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 3: Dielectric Liquid Cooling of Immersed Components
ISBN: 9789814313827 / Angielski / Twarda / 2013 / 388 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
cena:
1379,74 zł |
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Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 4: Thermoelectric Microcoolers
ISBN: 9789814313834 / Angielski / Twarda / 2013 / 260 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
cena:
1203,38 zł |
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Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 5: Energy Efficient Solid State Lighting
ISBN: 9789814327619 / Angielski / Twarda / 2013 / 168 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
cena:
1032,21 zł |
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Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)
ISBN: 9789811201110 / Angielski / Twarda / 2019 / 1080 str. Termin realizacji zamówienia: ok. 22 dni roboczych. |
cena:
6431,88 zł |
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