Kategoria BISAC: Technology & Engineering >> Electronics - Microelectronics

Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of...

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

In the past decades, the main stream of microelectronics progress has been mainly powered by Moore's law which focuses on IC miniaturization down to nanoscale. While the microelectronics community around the world continues to invent new solutions to keep Moore's law alive, there is a fast increasing need for non-digital and mixed-signal More than Moore (MtM) type technologies that are still based upon or derived from silicon technologies, but do not simply scale with Moore's law. Typical examples are devices incorporating RF, power/high voltage, passive components, sensors and actuators,...

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.

The book also includes exercises and...

Compact Models for Integrated Circuit Design: Conventional Transistors and Beyond provides a modern treatise on compact models for circuit computer-aided design (CAD). Written by an author with more than 25 years of industry experience in semiconductor processes, devices, and circuit CAD, and more than 10 years of academic experience in teaching compact modeling courses, this first-of-its-kind book on compact SPICE models for very-large-scale-integrated (VLSI) chip design offers a balanced presentation of compact modeling crucial for addressing current modeling challenges and understanding...

• Contributions from leading authorities
• Informs and updates on all the latest developments in the field

Harvesting kinetic energy is a good opportunity to power wireless sensor in a vibratory environment. Besides classical methods based on electromagnetic and piezoelectric mechanisms, electrostatic transduction has a great perspective in particular when dealing with small devices based on MEMS technology. This book describes in detail the principle of such capacitive Kinetic Energy Harvesters based on a spring-mass system. Specific points related to the design and operation of kinetic energy harvesters (KEHs) with a capacitive interface are presented in detail: advanced studies on their...

Over the past decade, ZnO as an important II-VI semiconductor has attracted much attention within the scientific community over the world owing to its numerous unique and prosperous properties. This material, considered as a -future material-, especially in nanostructural format, has aroused many interesting research works due to its large range of applications in electronics, photonics, acoustics, energy and sensing. The bio-compatibility, piezoelectricity & low cost fabrication make ZnO nanostructure a very promising material for energy harvesting.

Dedicated to SiC-based 1D nanostructures, this book explains the properties and different growth methods of these nanostructures. It details carburization of silicon nanowires, a growth process for obtaining original Si-SiC core-shell nanowires and SiC nanotubes of high crystalline quality, thanks to the control of the siliconout-diffusion. The potential applications of these particular nano-objects is also discussed, with regards to their eventual integration in biology, energy and electronics.

Over the past two decades, the rapid development of nanochemistry and nanotechnology has allowed the synthesis of various materials and oxides in the form of nanopowders making it possible to produce new energetic compositions and nanomaterials.

This book has a bottom-up structure, from nanomaterials synthesis to the application fields. Starting from aluminum nanoparticles synthesis for fuel application, it proposes a detailed state-of-the art of the different methods of preparation of aluminum-based reactive nanomaterials. It describes the techniques developed for their...