Kategoria BISAC: Technology & Engineering >> Electronics - Microelectronics

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.

The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:

• Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
• Supplies state-of-the-art solutions...

The rapid advancement of integrated optoelectronics has been driven considerably by miniaturization. Following the path taken in electronics of reducing devices to their ultimately fundamental forms, for instance single-electron transistors, now optical devices have also been scaled down, creating the increasingly active research fields of integrated and coupled photonic systems. The interactions between the coupled integrated micro- and nanostructures can provide us with the fundamental understanding and engineering of complex systems for a variety of applications.

This...

Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals

The book presents the future developments and innovations in the developing field of microelectronics. The book's chapters contain contributions from various authors, all of whom are leading industry professionals affiliated either with top universities, major semiconductor companies, or government laboratories, discussing the evolution of their profession. A wide range of microelectronic-related fields are examined, including solid-state...

Photonics and electronics are endlessly converging into a single technology by exploiting the possibilities created by nanostructuring of materials and devices. It is expected that next-generation optoelectronic devices will show great improvements in terms of performance, flexibility, and energy consumption: the main limits of nanoelectronics will be overcome by using a photonics approach, while nanophotonics will become a mature technology, thanks to miniaturization strategies developed in microelectronics.

Mastering such a complex subject requires a multidisciplinary...

Text provides information about advanced OTFT (Organic thin film transistor) structures, their modeling and extraction of performance parameters, materials of individual layers, their molecular structures, basics of pi-conjugated semiconducting materials and their properties, OTFT charge transport phenomena and fabrication techniques. It includes applications of OTFTs such as single and dual gate OTFT based inverter circuits along with bootstrap techniques, SRAM cell designs based on different material and circuit configurations, light emitting diodes (LEDs). Besides this, application of...

Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems

A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the...

This book aims to develop professional and practical microcontroller applications in the ARM-MDK environment with Texas Instruments MSP432P401R LaunchPad kits. It introduces ARM Cortex-M4 MCU by highlighting the most important elements, including: registers, pipelines, memory, and I/O ports. With the updated MSP432P401R Evaluation Board (EVB), MSP-EXP432P401R, this MCU provides various control functions with multiple peripherals to enable users to develop and build various modern control projects with rich control strategies. Micro-controller programming is approached with basic and...

• Provides advanced level material of electron transport in nanoscale devices from basic principles of quantum mechanics through to advanced theory and various numerical techniques for electron transport
• Combines several up-to-date theoretical and numerical approaches in a unified manner, such as Wigner-Boltzmann equation, the recent progress of carrier transport research for nanoscale MOS transistors, and quantum correction approximations
• The authors approach the subject in...

Presenting the new IEEE 802.16m standard, this is the first book to take a systematic, top-down approach to describing Mobile WiMAX and its next generation, giving detailed algorithmic descriptions together with explanations of the principles behind the operation of individual air-interface protocols and network components.

Features:

• A systematic and detailed, top-down approach to the design of 4G cellular systems based on IEEE 802.16m and 3GPP LTE/LTE-Advanced technologies
• A systematic approach to understanding IEEE 802.16m radio access network and mobile...

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.

The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this...

With the proliferation of wireless networks, there is a need for more compact, low-cost, power efficient transmitters that are capable of supporting the various communication standards, including Bluetooth, WLAN, GSM/EDGE, WCDMA and 4G of 3GPP cellular. This book describes a novel idea of RF digital-to-analog converters (RFDAC) and demonstrates how they can realize all-digital, fully-integrated RF transmitters that support all the current multi-mode and multi-band communication standards.

With this book the reader will:

• Understand the challenges of realizing a...