ilość książek w kategorii: 1723
| |
Nanoscale Silicon Devices
ISBN: 9781138749320 / Angielski / Miękka Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
308,51 |
| |
Compound Semiconductors: Physics, Technology, and Device Concepts
ISBN: 9789814774079 / Angielski / Twarda / 294 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
465,29 |
![]() |
Novel Wearable Antennas for Communication and Medical Systems
ISBN: 9781138047907 / Angielski / Twarda / 420 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Novel Wearable Antennas discusses the technology to develop compact, efficient, wearable antennas. Elementary electromagnetics and communication basic theory is provided to assist those who do not have a background in basic design, principles, and features of antennas, printed antennas, and wearable antennas. Details of mathematics and explanations are provided as well as new topics and design methods in the area of wearable antennas, RF measurement techniques and measured results in the vicinity of the human body, setups, and design considerations are presented for the first time. HFSS... Novel Wearable Antennas discusses the technology to develop compact, efficient, wearable antennas. Elementary electromagnetics and communication ba... |
cena:
930,57 |
| |
Simulation of Semiconductor Processes and Devices 2007: Sispad 2007
ISBN: 9783709119112 / Angielski / Miękka / 463 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta- tion and discussion of outstanding...
The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and i...
|
cena:
603,81 |
![]() |
Introduction to Mixed-Signal, Embedded Design
ISBN: 9781493939442 / Angielski / Miękka / 452 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Using PSoC mixed-signal array design, the authors of this book define the characteristics of embedded design, embedded mixed-signal architectures, and top-down design. Weaving theory and applications together, the book contains numerous exercises.
Using PSoC mixed-signal array design, the authors of this book define the characteristics of embedded design, embedded mixed-signal architectures, and...
|
cena:
241,34 |
![]() |
Passive Components Industry Buyer's Guide: A Global Directory of Manufacturers of Capacitors, Resistors, Inductors and related Raw Materials
ISBN: 9781548478421 / Angielski / Miękka / 60 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
68,74 |
![]() |
The Aluminum Electrolytic Capacitor Issue: Passive Component Industry Magazine: Aluminum Electrolytic Capacitor Industry; Anode and Cathode Foils; Org
ISBN: 9781548485160 / Angielski / Miękka / 46 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This issue of Passive Component Industry Magazine focuses on the global aluminum electrolytic capacitor industry with articles that include key aspects of the supply chain including capacitors, etched anode and cathode foils and organic polymer cathode materials.
This issue of Passive Component Industry Magazine focuses on the global aluminum electrolytic capacitor industry with articles that include key aspect...
|
cena:
80,72 |
![]() |
Passive Component Industry: Film Capacitors: Market Outlook
ISBN: 9781548510251 / Angielski / Miękka / 36 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. DC Film Capacitors: Outlook There is no question that DC Film capacitors are facing difficult market conditions on multiple fronts. AC Film Capacitors: Market Outlook Like most segments of the passive component industry, AC film capacitor shipments suffered during last year's global economic downturn. New Metallized Polypropylene Film Capacitors for Resonant Applications in the Lighting Industry The benefits of electronic ballast for lighting are well documented, and include high efficiency, energy saving and longer lifetime. Radial Lead Film Capacitors Testing/Sorting Machine Capacitors with...
DC Film Capacitors: Outlook There is no question that DC Film capacitors are facing difficult market conditions on multiple fronts. AC Film Capacitors...
|
cena:
80,72 |
![]() |
Passive Component Industry: Ceramic & Tantalum Capacitors
ISBN: 9781548510572 / Angielski / Miękka / 46 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. In this issue of Passive Component Industry we take a close look at the development of soft terminations to increase the performance of ceramic chip capacitors; we also look at ESR trends in tantalum capacitors and the strategy of manufacturing polymer based cathode systems for capacitors. The unique issues facing solid capacitors are also discussed in this groundbreaking edition.
In this issue of Passive Component Industry we take a close look at the development of soft terminations to increase the performance of ceramic chip c...
|
cena:
80,72 |
![]() |
Passive Component Industry: Circuit Protection
ISBN: 9781548511838 / Angielski / Miękka / 44 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. In This Issue of Passive Component Magazine we explore the global circuit protection component market with emphasis upon Electrostatic discharge suppression component required for protecting sensitive BUS systems against the effects of ESD. This issue also contains an essay on the advancement of metal oxide varistor technology.
In This Issue of Passive Component Magazine we explore the global circuit protection component market with emphasis upon Electrostatic discharge suppr...
|
cena:
80,72 |
![]() |
Passive Component Industry: Passive Components In Automotive Applications
ISBN: 9781548512576 / Angielski / Miękka / 46 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Passive Components in Automotive Electronics-Past, Present, Future; including a specialty essay on electrolytic type capacitors in automotive applications.
Passive Components in Automotive Electronics-Past, Present, Future; including a specialty essay on electrolytic type capacitors in automotive applicat...
|
cena:
80,72 |
![]() |
Passive Component Industry: Passive Components In Computers
ISBN: 9781548512873 / Angielski / Miękka / 46 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. In this issue Passive Component Industry addresses capacitance impedance for future computer microprocessors; including the latest trends in capacitor technology to addresses equivalent series resistance issues in electrolytic type capacitors.
In this issue Passive Component Industry addresses capacitance impedance for future computer microprocessors; including the latest trends in capacitor...
|
cena:
80,72 |
![]() |
Passive Component Industry: Technology in End-Use Markets Drives Miniaturization
ISBN: 9781548515461 / Angielski / Miękka / 44 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. In this issue of Passive Component Industry we focus on the "Giant Step" in miniaturization of electronic products in multiple end-use market segments driving demand for greater volumetric efficiency in electronic components. The issue also looks at the next step of putting electronic components inside the printed circuit board as an integral substrate material.
In this issue of Passive Component Industry we focus on the "Giant Step" in miniaturization of electronic products in multiple end-use market segments...
|
cena:
80,72 |
![]() |
The Structure of The European High-Tech Economy
ISBN: 9781548862183 / Angielski / Miękka / 36 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. This book is designed as a template for success for those who wish to sell high technology components and materials into the complex and fragmented European market. This book breaks down the European high tech economy into serviceable regions and countries and describes key customers, factories and end-users of electronic components and materials in the European region.
This book is designed as a template for success for those who wish to sell high technology components and materials into the complex and fragmented Eu...
|
cena:
40,43 |
![]() |
Flexible and Stretchable Electronics
ISBN: 9783038424369 / Angielski / Miękka / 180 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych.
|
cena:
213,49 |
![]() |
Electronics Explained: Fundamentals for Engineers, Technicians, and Makers
ISBN: 9780128116418 / Angielski / Miękka / 400 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Electronics Explained, Second Edition, takes a systems based approach to the fundamentals of electronics, covering the different types of electronic circuits, how they work, and how they fit together to create modern electronic equipment, enabling you to apply, use, select, operate and discuss common electronic products and systems. This new edition has been updated to show the latest technological trends with added coverage of:
Electronics Explained, Second Edition, takes a systems based approach to the fundamentals of electronics, covering the different types of el... |
cena:
176,07 |
![]() |
Op Amps for Everyone
ISBN: 9780128116487 / Angielski / Miękka / 484 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
288,72 |
![]() |
Arduino: Step-By-Step Guide to Master Arduino Hardware and Software
ISBN: 9781976097713 / Angielski / Miękka / 222 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. |
cena:
58,18 |
![]() |
From Additive Manufacturing to 3d/4D Printing 1: From Concepts to Achievements
ISBN: 9781786301192 / Angielski / Twarda / 354 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. In 1984, additive manufacturing represented a new methodology for manipulating matter, consisting of harnessing materials and/or energy to create three–dimensional physical objects. Today, additive manufacturing technologies represent a market of around 5 billion euros per year, with an annual growth between 20 and 30%. Different processes, materials and dimensions (from nanometer to decameter) within additive manufacturing techniques have led to 70,000 publications on this topic and to several thousand patents with applications as wide–ranging as domestic uses. Volume 1 of... In 1984, additive manufacturing represented a new methodology for manipulating matter, consisting of harnessing materials and/or energy to create t... |
cena:
680,54 |
![]() |
From Additive Manufacturing to 3d/4D Printing 2: Current Techniques, Improvements and Their Limitations
ISBN: 9781786301208 / Angielski / Twarda / 350 str. Termin realizacji zamówienia: ok. 5-8 dni roboczych. Additive manufacturing, which was first invented in France and then applied in the United States, is now 33 years old and represents a market of around 5 billion euros per year, with annual growth of between 20 and 30%. Today, additive manufacturing is experiencing a great amount of innovation in its processes, software, engineering and materials used. Its strength as a process has more recently allowed for the exploration of new niches, ranging from applications at nanometer and decameter scales, to others in mechanics and health. As a result, the limitations of the process have also... Additive manufacturing, which was first invented in France and then applied in the United States, is now 33 years old and represents a market of ar... |
cena:
716,35 |