The SISDEP 93 conference proceedings present outstanding research and development results in the area of numerical process and device simulation. The miniaturization of today's semiconductor devices, the usage of new materials and advanced process steps in the development of new semiconductor technologies suggests the design of new computer programs. This trend towards more complex structures and increasingly sophisticated processes demands advanced simulators, such as fully three-dimensional tools for almost arbitrarily complicated geometries. With the increasing need for better models and...

The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding...

C ist eine der bedeutendsten und eine sehr haufig eingesetzte Programmiersprache. Die Autoren haben jahrelange Erfahrung mit dieser Programmiersprache und vermitteln Lesern das Wesentliche die Programmiermethodik: Was ist Programmieren? Wie werden programmtechnische Probleme gelost? Schrittweise wird die Programmierung anhand der Sprache C erlernt und mit Beispielen und Aufgaben vertieft. Der Sprachumfang von C wird vorgestellt und kritisch betrachtet, um typische Fehler zu vermeiden. Vorkenntnisse im Programmieren werden nicht vorausgesetzt."

The SISDEP 93 conference proceedings present outstanding research and development results in the area of numerical process and device simulation. The miniaturization of today s semiconductor devices, the usage of new materials and advanced process steps in the development of new semiconductor technologies suggests the design of new computer programs. This trend towards more complex structures and increasingly sophisticated processes demands advanced simulators, such as fully three-dimensional tools for almost arbitrarily complicated geometries. With the increasing need for better models and...

The proceedings of the first "Workshop on Technology CAD Systems is an authoritative tutorial on CAD software systems for the physical design of semiconductor devices and manufacturing processes. Fourteen invited papers by academic and industrial representatives from USA, Europe, and Japan, as well as from commercial software vendors provide an excellent overview of the work in this area. This book covers the following topics: Coupling and integration of process simulation, device simulation, parameter extraction, and circuit simulation, technology CAD requirements, architectures and...

The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta- tion and discussion of outstanding...