Kategoria BISAC: Technology & Engineering >> Electronics - Circuits - General

This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.

In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and...

This book offers the latest research results on analog side channels and their usage in cybersecurity. It demystifies analog side channels and demonstrates new use cases for them. The first part of this book discusses how analog side channels are generated, the physics behind it, the modeling and measurements of analog side channels, and their analogies to wireless communication systems. The second part of this book introduces new applications that benefit from leveraging side channels. In addition to breaking cryptography algorithms, it demonstrates how analog side channels can be used...

This book deals with a practical approach to defining a system on a chip (SoC) architecture. It is written by practicing industry experts with cumulative five decades of hands-on experience. The book discusses how the system-level design challenges are addressed at the architecture stage and clearly defines different SoC subsystems and components. The book explains the practical method of determining system subsystems in system architectures.