In this book, stress dependent thermal wet oxide growth process is described. The oxidation rate of silicon is function of the crystal orientation and the angle of the plane intersection. The silicon surface micromachining processes are described to make a freestanding mechanical structure and unique three-dimensional features. A bulk micromachining and etchant has to be considered during microfabrication.Schematic and SEM micrograph described as metal (aluminum) sputtered on oxide pyramidal cantilever probe to form metallic nano-aperture as well. The theoretical concept of near-field and...