Increasing performance and the associated junction temperature in the field of power electronics require new packaging and connection technology. Besides conventional soldering and ultrasonic welding, the novel "Laser Impulse Metal Bonding" (LIMBO) process opens up possibilities to meet these requirements in electronic packaging. The gap-bridging LIMBO process enables a weld joint on thermally sensitive substrates by thermal separation of the joining partners. The gap bridging is realized by melt pool deflection due to a sudden expansion of the vapor capillary in the melt using temporal laser...