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Kategorie szczegółowe BISAC
 Wafer Level 3-D ICS Process Technology Tan, Chuan Seng 9780387765327 Not Avail
Wafer Level 3-D ICS Process Technology

Tan, Chuan Seng
Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In...
Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry s vexing problems: heterogeneous integration a...
cena: 603,81
 Wafer Level 3-D ICS Process Technology Tan, Chuan Seng 9781441945624 Springer
Wafer Level 3-D ICS Process Technology

Tan, Chuan Seng
Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In...
Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry s vexing problems: heterogeneous integration a...
cena: 603,81
 Advances in 3D Integrated Circuits and Systems Hao Yu Chuan Seng Tan 9789814699006 World Scientific Publishing Company
Advances in 3D Integrated Circuits and Systems

Hao Yu Chuan Seng Tan
cena: 612,21
 Advances in 3D Integrated Circuits and Systems Hao Yu Chuan Seng Tan 9789814699013 World Scientific Publishing Company
Advances in 3D Integrated Circuits and Systems

Hao Yu Chuan Seng Tan
3D integration is an emerging technology for the design of many-core microprocessors and memory integration.
3D integration is an emerging technology for the design of many-core microprocessors and memory integration.
cena: 235,10
 Physical Design for 3D Integrated Circuits Aida Todri-Sanial Chuan Seng Tan 9781498710367 CRC Press
Physical Design for 3D Integrated Circuits

Aida Todri-Sanial Chuan Seng Tan

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.

The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:

  • Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
  • Supplies state-of-the-art solutions...

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the desig...

cena: 857,10


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