While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on...
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key i...
Besides offering significant advantages over traditional rigid boards, flexible circuitry is increasingly the technology of choice for military and commercial applications, including the growing ASICs market. This book addresses the many new uses, applications, and developments of flexible circuitry, the most popular form of interconnection for applications requiring size and weight reduction, better impedance, reduced labour, and easy assembly.
Besides offering significant advantages over traditional rigid boards, flexible circuitry is increasingly the technology of choice for military and co...
Ken Gilleo's Polymer Thick Film provides you with all the essential concepts, process descriptions, performance data, and general information you will need to reach your own conclusions. The focus will be on polymer thick film's major subsets, which include conductive inks, printed resistors, dielectric films or pastes, and polymer assembly material.
Ken Gilleo's Polymer Thick Film provides you with all the essential concepts, process descriptions, performance data, and general information you will...
This engineering reference covers the most important assembly processes in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Processes includes vital information necessary for the manufacture of cutting-edge electronics products.
This engineering reference covers the most important assembly processes in modern electronic packaging. Written by a team of world-class professionals...
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-clas...
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class profession...
