Area Array Package Design

ISBN-13: 9780071737739 / Angielski / Miękka / 2003 / 220 str.

Ken Gilleo

Opis

This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.