Traditional Dynamic Random Access Memories (DRAMs) no longer have adequate bandwidth and access time to keep up with the speed of current microprocessors. In order to increase speed and efficiency many work station and mainframe manufacturers are starting to use high performance memories.

Emerging Memories: Technologies and Trends attempts to provide background and a description of the basic technology, function and properties of emerging as well as discussing potentially suitable applications.
This book explores a range of new memory products and technologies. The concept for some of these memories has been around for years. A few completely new. Some involve materials that have been in volume production in other type of devices for some time. Ferro-electrics, for example, have been used in capacitors for more than 30 years. In addition to looking at...

Provides the reader with memory fundamentals as well as directions for future research. Examines memory history, current memory technology and offers a glimpse at the future of memories. Topics include memory market trends and their importance to both industry and government applications requirements which determine the direction of memory development and technical aspects of memories. Descriptions and usage of the various types of memories including SRAMs, DRAMs, VDRAMs, EPROMs, EEPROMs, and ROMs are also provided. Finally, it looks at memory packing, large scale integration, and the...

Emerging Memories: Technologies and Trends attempts to provide background and a description of the basic technology, function and properties of emerging as well as discussing potentially suitable applications.
This book explores a range of new memory products and technologies. The concept for some of these memories has been around for years. A few completely new. Some involve materials that have been in volume production in other type of devices for some time. Ferro-electrics, for example, have been used in capacitors for more than 30 years. In addition to looking at...

The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate–all–around and junction–less nanowire memories, stacked thin film and...